Recomended footprint for TFBGA240+25.

[VTimo]

We have some problem with soldering this package.

Does it correct for ball diametr 0.4mm make Dpad = 0.225, Dsm = 0.29mm?

[TDK]

Recommended footprints are in the device datasheet.

However, this is more of an assembly house question than an ST question. Ask your assembly house for guidelines, they always have an opinion.

[SofLit]

Dear @VTimo​ ,

For H7, Datasheet will be updated with the following values:

Dpad = 0.3mm and Dsm = 0,4mm

SofLit

[Manuel Del Basso]

Comparing the Recomended footprint for TFBGA240+25 between STM32H757XI and STM32H753XI

datasheets, there are still differences.

 

https://www.st.com/resource/en/datasheet/stm32h757xi.pdf

https://www.st.com/resource/en/datasheet/stm32h753xi.pdf

In the CAD resources library from ST the BGA pads are of size 0.229mm.

https://www.st.com/en/microcontrollers-microprocessors/stm32h757xi.html#cad-resources

I'm interested in the correct footprint for stm32h757xi.

Kind regards, manuel

[SofLit]

Hello,

We are aware of that and all the datasheets related to STM32H74x and STM32H75x devices will be updated with the new values.

All these datasheets will be available soon on the web.

[Manuel Del Basso]

Hi,

ok, so the 0.3mm and 0.4mm are correct for my stm32h757xi.

Thanks!

Kind regards, manuel

[SofLit]

Yes I confirm. And I already double checked that it was already fixed in an internal revision of STM32h757 datasheet that will be available soon on ST website.