hi various SOCs in STM32 family e.g. stm32f407ve, and many in the F7, H7 series features a "USB 2.0 high-speed/full-speed device/host/OTG controller with dedicated DMA, on-chip full-speed PHY and ULPI"
But your STULPI01 is a μTFBGA36 package.
https://www.st.com/en/interfaces-and-transceivers/stulpi01b.html
Could ST consider releasing a LQFP or QFN package that is 'more solderable'? Well, I'm nowhere a 'volume' user, more of a tinkerer, but that each time I revisit thinking about doing usb 2.0 high speed with the stm32 socs, this issue keeps bothering me. BGA requires a reflow reball station at least and is 'less accessible' than having those pins 'on the side' of the ICs. And while i've not tried, there could be challenges routing say a 2 sided smd pcb for BGA
