2024-06-10 7:00 AM - edited 2025-04-07 7:53 AM
This article includes preliminary updates of STM32 MCU reference manuals reported since 1st January 2024. It highlights the current description requiring update and the expected one if available.
The purpose of this article is to deliver any expected updates to our MCU reference manuals prior to actual documentation releases. We wish to be transparent with our updates and provide them as fast as possible, to assist you in your design process.
This article is updated on a quarterly basis. Once these preliminary updates are manifested in the reference manuals, this article is refreshed with new information.
Moving forward, we are also working on providing reference manual releases on a more frequent basis.
IMPORTANT NOTICE - READ CAREFULLY:
Function | Series(Lines) / Doc Reference Revision |
Update Location | Current Description / Expected Description |
Date of added update |
NVIC |
STM32L47xxx, STM32L48xxx, STM32L49xxx STM32L4Axxx
(Oct 2023) |
Table 58. STM32L47x/ |
Current: 4. HASH available on STM32L4Ax devices only. Expected: 4. HASH available on STM32L4Ax devices onlySTM32L4Ax/L49x devices only. |
Oct 2024 |
RCC |
STM32H742 STM32H743 STM32H753 STM32H750
(Jan 2023) |
Table 60. Kernel clock distribution overview |
Current: Maximum allowed frequency [MHz] for ADC1,2,3 are: with note "4. With a duty cycle close to 50%, meaning that DIV[P/Q/R]x values shall be even. For SDMMCx, the duty cycle shall be 50% when supporting DDR." Expected: Maximum allowed frequency [MHz] for ADC1,2,3 are: |
Mar 2024 |
STM32H523xx
RM0481 Rev3 |
11.8.8 RCC PLL clock source selection register (RCC_ PLL2CFGR) |
Current: 0: wide VCO range 192 to 836 MHz (default after reset) Expected: 0: wide VCO range 128 to 560MHz (default after reset) |
Sep 2024 | |
STM32H523xx
RM0481 Rev3 |
11.8.13 RCC PLL2 fractional divider register (RCC_ PLL2FRACR) |
Current: * PLL2FRACN can be between 0 and 213- 1 Expected: * FRACN2 can be between 0 and (2^13)-1 |
Sep 2024 | |
STM32H723 (Dec 2021) |
8.7.39 RCC AHB3 clock register (RCC_ AHB3ENR) |
Expected: |
Dec 2024 | |
STM32H723 (Dec 2021) |
8.7.28 RCC AHB1 peripheral reset register(RCC_ AHB1RSTR) |
Current: Bit 1 DMA2RST: DMA2 block reset Expected: Bit 1 DMA2RST: DMA2 and DMAMUX1 reset |
Dec 2024 | |
STM32H723 (Dec 2021) |
8.7.30 RCC AHB4 peripheral reset register (RCC_ AHB4RSTR) |
Current: Bit 21 BDMARST: BDMA block reset Expected: Bit 21 BDMARST: BDMA block reset |
Dec 2024 | |
STM32U0
(Mar 2024) |
5.2.6 LSE clock |
Expected: Add: Distribution of the LSE clock out of RTC block is gated by default to achieve lowest power consumption. Set LSESYSEN bit in the RCC-BDCR to release clock distribution to LCD, SYSCLK, LSCO and MCO. |
Dec 2024 | |
STM32U0
(Mar 2024) |
5.4.22 RTC domain control register (RCC_BDCR) |
Current: Bit 2 LSEBYP: LSE oscillator bypass Expected: Bit 2 LSEBYP: LSE oscillator bypass |
Dec 2024 | |
STM32F205xx, STM32F207xx STM32F215xx STM32F217xx
(Feb 2021) |
5.3.20 RCC Backup domain control register (RCC_BDCR) |
Current: Bit 2 LSEBYP: External low-speed oscillator bypass Expected: Bit 2 LSEBYP: External low-speed oscillator bypass |
Mar 2025 | |
STM32F303xB
(Jan 2024) |
Figure 14. STM32F303xDxE and STM32F398xE clock tree |
Current: Expected: |
Mar 2025 | |
STM32WBA6 (Feb 2025)
|
12.8.9 RCC clock interrupt enable register (RCC_CIER) |
Expected: - Add note to LSI2RDYIE: Note: If the LSI2 is ready (LSI2RDY in RCC_BDCR1 is 1) before enabling LSI2RDYIE, the LSI2RDYF in RCC_CIFR will not be set and no interrupt is generated. - Add note to PLL1RDYIE: Note: If the PLL1 is ready (PLL1RDY in RCC_CR is 1) before enabling PLL1RDYIE, the PLL1RDYF in RCC_CIFR will not be set and no interrupt is generated. - Add note to HSERDYIE: Note: If the HSE is ready (HSERDY in RCC_CR is 1) before enabling HSERDYIE, the HSERDYF in RCC_CIFR will not be set and no interrupt is generated. - Add note to HSIRDYIE: Note: If the HSI16 is ready (HSIRDY in RCC_CR is 1) before enabling HSIRDYIE, the HSIRDYF in RCC_CIFR will not be set and no interrupt is generated. - Add note to LSERDYIE: Note: If the LSE is ready (LSERDY in RCC_BDCR1 is 1) before enabling LSERDYIE, the LSERDYF in RCC_CIFR will not be set and no interrupt is generated. - Add note to LSI1RDYIE: Note: If the LSI1 is ready (LSI1RDY in RCC_BDCR1 is 1) before enabling LSI1RDYIE, the LSI1RDYF in RCC_CIFR will not be set and no interrupt is generated. |
Mar 2025 | |
FLASH |
STM32H745 (Jun 2023)
STM32H7A3 (Dec 2023)
STM32H742 STM32H743 (Jan 2023)
STM32H723 (Dec 2021)
STM32H7Rx/ RM0477 Rev8 |
FLASH erase operations |
Current: "1. Check and clear (optional) all the error flags due to previous programming/erase operation. Refer to Section 5.7: FLASH error management for details." Expected: "Remove (optional) word."
|
Aug 2024 |
Table xx. Flash interrupt request |
Expected: Add notes to Clear flag to resume operation for: -Write protection error: Check this flag after an erase operation. -Programming sequence error and Inconsistency error: Check and clear all the (PGSEER, INCERR, STRBERR) error flags due to previous write operation. |
Aug 2024 |
||
STM32L4+
(Jun 2021) |
Table 9. Flash module - 1 Mbyte single-bank organization, DB1M = 0 (128 bits read width) |
Expected: |
Sep 2024 |
|
STM32L4+
(Jun 2021) |
3.7.8 Flash option register (FLASH_OPTR) |
Current: "Note: For 1-Mbyte and 512-Kbyte Flash memory devices, do not care about DBANK" Expected: "Note: For 1-Mbyte and 512-Kbyte Flash memory devices, the DBANK option bit must not be used and must be kept at its ST production value of “1”." |
Sep 2024 |
|
STM32L0x1 (Feb 2022) |
3.7.8 Option bytes register (FLASH_OPTR) |
Current: All bits on FLASH_OPTR register are set to read only. Expected: RDPROT -> read-only |
Mar 2025 |
|
TIM |
STM32F469xx STM32F479xx (May 2024) |
22.4.9 TIM1&TIM8 capture/ |
Current: Bits 15:14 Reserved, must be kept at reset value. Expected: Bit 15 CC4NP: Capture/Compare 4 complementary output polarity refer to CC1NP description |
Dec 2024 |
STM32F413 (Oct 2024) |
17.4.9 TIM1&TIM8 capture/ |
|||
STM32H723 (Dec 2021) |
44.3.11 Combined PWM mode |
Current: When a given channel is used as combined PWM channel, its secondary channel must be configured in the opposite PWM mode (for instance, one in Combined PWM mode 1 and the other in Combined PWM mode 2) Expected: When a given channel is used as combined PWM channel, its secondary channel must be configured in the opposite PWM mode (for instance, one in Combined PWM mode 1 and the other in PWM mode 2) |
Dec 2024 |
|
LPUART |
STM32L0x3
(Feb 2022) |
Table 150. Error calculation for programmed baud rates at fck = 32 MHz |
Current: Table 150. Error calculation for programmed baud rates at fck = 32 MHz Expected: Table 150. Error calculation for programmed baud rates at fck = 32.768 KHz |
May 2024 |
RTC |
STM32H523xx
(Apr 2024) |
Table 495. PI8 configuration |
Current: "Table 495. PI8 configuration" Expected: "Table 495. PI8/PB2 configuration" |
Jun 2024 |
STM32H503 (Nov 2024) |
Table 243. RTC register map and reset values (continued) |
Expected: RTC_OR register have to be removed
|
Mar 2025 |
|
ETH |
STM32H723
(Dec 2021) |
Table 543. Ethernet peripheral pins |
Expected: Remove "ETH_PHY_INTN" from Table Ethernet peripheral pins |
Apr 2024 |
STM32H742 STM32H743
(Jan 2023) |
Table 522. Ethernet peripheral pins |
Current: "ETH_PHY_INTN" Expected: Remove "ETH_PHY_INTN" from Table Ethernet peripheral pins |
May 2024 |
|
STM32H523xx
(Mar 2025)
|
57 Ethernet (ETH): media access control |
Expected: |
Sep 2024 |
|
STM32F205xx, STM32F207xx STM32F215xx STM32F217xx
(Feb 2021) |
Figure 328. Frame transmission in MMI and RMII modes |
Expected: |
Mar 2025 |
|
PWR |
STM32U0
(Mar 2024) |
4.4.2 Power control register 2 (PWR_CR2) |
Current: Bit 10 USV(1) Bit 4 PVME1(1) with note "1. Available on STM32U0 devices only." Expected: Bit 10 USV(1) Bit 4 PVME1(1) with note "1. Available on STM32U0x3xx devices only." |
Apr 2024 |
STM32U0
(Mar 2024) |
4.4.2 Power control register 2 (PWR_CR2) |
Current: "1. Available on STM32U0x3xx devices only." Expected: Remove note "1. Available on STM32U0x3xx devices only." |
Jul 2024 |
|
STM32F76xxx STM32F77xxx
(Jul 2024) |
4.3 Low-power modes |
Current: "The MCU exits from Standby low-power mode through an external reset (NRST pin), an IWDG reset, a rising edge on one of the enabled WKUPx pins or a RTC event occurs" Expected: "The MCU exits from Standby low-power mode through an external reset (NRST pin), an IWDG reset, a rising or falling on one of the enabled WKUPx pins or a RTC event occurs" |
Aug 2024 |
|
STM32L47xxx STM32L48xxx STM32L49xxx STM32L4Axxx
(Oct 2023) |
Table 23. Functionalities depending on the working mode |
Current: 5. Not available on STM32L47x/L48x/L49x devices. Expected: 5. Not available on STM32L47x/L48x devices.” |
Oct 2024 |
|
STM32L47xxx STM32L48xxx STM32L49xxx STM32L4Axxx
(Oct 2023) |
6.4.11 AHB2 peripheral reset register (RCC_ |
Current: Bit 17 HASHRST: Hash reset (this bit is reserved for STM32L47x/L48x/L49x devices) Expected: Bit 17 HASHRST: Hash reset(this bit is reserved for STM32L47x/L48x devices) |
Oct 2024 |
|
STM32L47xxx STM32L48xxx STM32L49xxx STM32L4Axxx
(Oct 2023) |
6.4.17 AHB2 peripheral clock enable register (RCC_ |
Current: Bit 17 HASHEN: HASH clock enable (this bit is reserved for STM32L47x/L48x/L49x devices) Expected: Bit 17 HASHEN: HASH clock enable (this bit is reserved for STM32L47x/L48x devices) |
Oct 2024 |
|
STM32L47xxx, STM32L48xxx, STM32L49xxx STM32L4Axxx
(Oct 2023) |
6.4.23 AHB2 peripheral clocks enable in Sleep and Stop modes register |
Current: Bit 17 HASHSMEN: HASH clock enable during Sleep and Stop modes (this bit is reserved for STM32L47x/L48x/L49x devices) Expected: Bit 17 HASHEN: HASH clock enable (this bit is reserved for STM32L47x/L48x devices) |
Oct 2024 |
|
STM32L47xxx, STM32L48xxx, STM32L49xxx STM32L4Axxx (Oct 2023) |
5.3.10 Shutdown mode |
Current: Exiting Shutdown mode Expected: Add WUFx bits in the PWR_SR1 register are cleared by power-on reset during Shutdown mode exit. They will be seen as set only if the related wake-up signal is longer than release of the power-on reset signal. |
Dec 2024
|
|
STM32U0
(Mar 2024) |
4.3.10 Shutdown mode |
|||
STM32U0
(Mar 2024) |
Table 30. Shutdown mode |
Current: WKUPx pin edge, RTC event, external Reset in NRST pin Expected: WKUPx pin edge, RTC event, TAMP event, external Reset on NRST pin |
Dec 2024 |
|
STM32L47xxx, STM32L48xxx, STM32L49xxx STM32L4Axxx (Oct 2023) |
5.4.5 Power status register 1 (PWR_SR1) |
Current: This register is neither reset when exiting Standby or Shutdown mode, nor by the PWRRST bit in the RCC_APB1RSTR1 register. Expected: This register is neither reset when exiting Standby mode, nor by the PWRRST bit in the RCC_APB1RSTR1 register. |
Dec 2024 |
|
STM32U0
(Mar 2024) |
4.4.5 Power status register 1 (PWR_SR1) |
|||
STM32L41xxx |
5.4.3 Power control register 3 (PWR_CR3) |
Mar 2025 |
||
STM32L41xxx |
5.3.9 Standby mode |
Current: The SBF status Expected: The SBF status flag in the Power status register (PWR_SR1) |
Mar 2025 |
|
STM32WBA6 (Feb 2025)
|
Table 88. Functionalities depending on the working mode |
Expected: Remove HSI48 |
Mar 2025 |
|
COMP |
STM32F303xB
(Jan 2024) |
17.5.3 COMP3 control and status register (COMP3_CSR)
17.5.4 COMP4 control and status register (COMP4_CSR)
17.5.5 COMP5 control and status register (COMP5_CSR)
17.5.6 COMP6 control and status register (COMP6_CSR)
17.5.7 COMP7 control and status register (COMP7_CSR) |
Current: Bits 3:2 COMPxMODE[1:0]: Comparator x mode (only in STM32F303xB/C and STM32F358xC devices.) Expected: Bits 3:2 COMPxMODE[1:0]: Comparator x mode (only in STM32F303xB/C and STM32F358xC devices.) 00: High speed |
Apr 2024 |
DBG |
STM32U5
(Jan 2025) |
75.8.1 BPU registers |
Current: Bit 1 KEY: Write protect key Expected: Bit 1 KEY: Write protect key |
Oct 2024 |
STM32WBA6 (Feb 2025) |
45.13.7 DBGMCU registers |
Current: DBGMCU identity code register (DBGMCU_IDCODER) Expected: DBGMCU identity code register (DBGMCU_IDCODE) |
Mar 2025 |
|
GPIO |
STM32L47xxx, STM32L48xxx, STM32L49xxx STM32L4Axxx
(Oct 2023) |
8.4 GPIO functional description |
Add section 8.3.4 I/O port state in Low-power modes |
Oct 2024 |
STM32L47xxx, STM32L48xxx, STM32L49xxx STM32L4Axxx
(Oct 2023) |
8.2 GPIO main features |
Add sentence Configurable state of each I/O in Standby mode: floating, pull-up/down, analog. |
Oct 2024 |
|
STM32F205xx, STM32F207xx STM32F215xx STM32F217xx
(Feb 2021) |
6.3.2 I/O pin multiplexer and mapping |
Current: • Cortex®-M3 EVENTOUT is mapped on AF15 Expected: • Cortex®-M3 output EVENTOUT signal can be used by configuring the I/O pin to output on AF15. |
Mar 2025 |
|
STM32H723 RM0468 Rev3 |
11.3.11 I/O compensation cell |
Add: Note: The activation of the I/O Compensation Cell is recommended with communication interfaces (GPIO, SPI, FMC, OSPI ...) when operating at high frequencies (please refer to product datasheet) |
Mar 2025 |
|
STM32WBA6 (Feb 2025) |
14.4.14 High-speed low-voltage mode (HSLV) |
Current: Caution: The I/O HSLV configuration bit cannot must not be set if the I/O supply (VDD or VDDIO2) is above 2.7 V. Expected: Caution: The I/O HSLV configuration bit must not be set if the I/O supply (VDD or VDDIO2) is above 2.7 V. |
Mar 2025 |
|
DMA |
STM32L47xxx, STM32L48xxx, STM32L49xxx STM32L4Axxx
(Oct 2023) |
Table 43. DMA1 and DMA2 implementation |
Current: 1. HASH related DMA channel is only applicable for STM32L4Ax devices. Expected: 1. HASH related DMA channel is only applicable for STM32L4Ax/L49x devices. |
Oct 2024 |
STM32L47xxx, STM32L48xxx, STM32L49xxx STM32L4Axxx
(Oct 2023) |
Table 45. DMA2 requests for each channel Figure 31. DMA block diagram |
Current: "3. Only available on STM32L4Ax devices." Expected: "3. Only available on STM32L4Ax/L49x devices." |
Oct 2024 |
|
Hash |
STM32L47xxx STM32L48xxx STM32L49xxx STM32L4Axxx
(Oct 2023) |
29 Hash processor (HASH) |
Current: This section applies to STM32L4Ax devices only. Expected: This section applies to STM32L4Ax/L49x devices only. |
Oct 2024 |
Memory and bus architec- ture |
STM32H745 (Jun 2023)
STM32H7A3 (Dec 2023)
STM32H742 STM32H743 (Jan 2023)
STM32H723 (Dec 2021) |
AXI interconnect - INI x AHB functionality modification register |
Current: Bit 1 WR_INC_OVERRIDE: Converts all AHB-Lite read transactions to a series of single beat AXI Expected: Bit 1 WR_INC_OVERRIDE: Converts all AHB-Lite write transactions to a series of single beat AXI transactions, and each AHB-Lite write beat is acknowledged with the AXI buffered write response. Bit 0 RD_INC_OVERRIDE: Converts all AHB-Lite read transactions to a series of single beat AXI transactions. |
Jul 2024 |
STM32H723 (Dec 2021) |
Table 7. Register boundary addresses |
Expected: Add: |
Dec 2024 |
|
STM32F303xB
(Jan 2024) |
Figure 1. STM32F303xB/C and STM32F358xC system architecture Figure 2. STM32F303x6/8 and STM32F328x8 system architecture Figure 3. STM32F303xDxE and STM32F398xE system architecture |
Current: FLTIF Expected: FLITF
|
Mar 2025 |
|
LCD |
STM32U0
(Mar 2024) |
19 Liquid crystal display controller (LCD) |
Add: Note: In the LCD chapter: |
Nov 2024 |
OCTOSPI |
STM32L552xx STM32L562xx
(Dec 2020) |
20.4.14 OCTOSPI Regular-command mode configuration |
Current: This shift is performed by an external delay block located outside the OCTOSPI. The control of this feature depends on the device implementation (see the product reference manual for more details). Expected: This shift is controlled via the RCC_DLYCFGR register. |
Dec 2024
|
STM32L552xx STM32L562xx
(Dec 2020) |
20.7.2 OCTOSPI device configuration register 1 (OCTOSPI_ |
Current: Bit 3 DLYBYP: Delay block bypass Expected: Bit 3 DLYBYP: Delay block bypass |
||
Device electronic signature |
STM32H723 RM0468 Rev3 |
66.4 Package data register |
Add:
|
Mar 2025 |
OTP |
STM32N647 |
Table 18. OTP fuse description (lower OTP region) |
Expected: iomgr_port: reserved iomgr_muxen: reserved
|
Mar 2025 |
SYSCFG |
STM32C0 (Dec 2024) |
9.1.3 SYSCFG configuration register 3 (SYSCFG_ |
Current: Bits 3:2 PINMUX1[1:0]: Pin GPIO multiplexer 1 Expected: Bits 3:2 PINMUX1[1:0]: Pin GPIO multiplexer 1 |
Mar 2025 |
TAMP |
STM32H503 (Nov 2024) |
33.6.16 TAMP option register (TAMP_OR) |
Add section: 33.6.16 TAMP option register (TAMP_OR) |
Mar 2025 |
System security |
STM32H523xx STM32H533xx STM32H562xx (Mar 2025) |
Table 20. Main product life cycle transitions |
Current: The product is returned for analysis to field return centers. Analysis is possible by opening it Expected: Add: STMicroelectronics does not perform analysis on defective parts in closed or locked states. |
Mar 2025 |
STM32H503 (Nov 2024) |
Table 5. Main product life-cycle transitions |