2020-08-19 06:12 AM
Solved! Go to Solution.
2020-09-17 04:08 AM
Hello Barak,
Please, find what we got in attachment from our package expert .
Hope this is what you expected,
Best Regards,
BB
2020-08-20 01:22 AM
Hello,
First of all, thanks for your interest in ST25DV04K.
Then, could you tell me precisely what info you are looking for, which could be missing in the datasheet in chapter 10.3, please ?
https://www.st.com/resource/en/datasheet/st25dv04k.pdf
Best Regards,
BB
2020-08-20 04:55 AM
Hi,
need recommended footprint for the UFDFN8,
for example you can see the recommended footprint for TSSOP8 in figure 81.
in chapter 10.3 there is only the device package drawing without the footprint,
Thanks,
Barak
2020-08-20 06:18 AM
Hello Barak,
You have to understand that the UDFN8 package pins are " flat" and "sticked" on the package itself, so the footprint is equal to the drawing.
This is not the same case forTSSOP8 package where the pins are not flat and "beside" the package.
I hope this helps,
Best Regards,
BB
2020-08-20 06:26 AM
Do you have EVB or gerbers with that footprint? so i could compare to my footprint,
usually the land pattern are not exactly the same as the package pins drawing,
Thanks,
Barak
2020-08-20 11:27 PM
Hello Barak,
land pattern usually also depend on stencil characteristics.
You can get an example of DFN12 land patterning on our website from ST25DV ANT-C5 gerber files, located here: https://www.st.com/content/st_com/en/products/evaluation-tools/product-evaluation-tools/st25-nfc-rfid-eval-tools/st25-nfc-rfid-eval-boards/st25dv-discovery.html#resource
Have a nice day
Denis
2020-08-23 12:32 AM
2020-08-24 12:38 AM
Hi Barak,
Unfortunately I don't have land patterning for DFN8, that's why I proposed DFN12 to be used as a example.
Have a nice day
Denis
2020-09-17 04:08 AM