TESEO-LIV3F mechanical specification

[AG.3]

The datasheet of TESEO-LIV3F shows top view and bottom view of IC under "Mechanical specifications" on page 28. But these images looks contradictory. Which one to follow to create the foot print ?

I have attached the image as shown in datasheet for your reference.

On top view as well in bottom view pin 1 is on top right. How ?

[BCoch]

I have an X-NUCLEO-GNSS1A1 with that chip on it. That pin numbering is the top view. I'm assuming the "bottom view" caption just applies to the pad area shown.

[BCoch]

(Note the divot on the top, which is on the outside of the chip, so just that area really is the bottom view.)

[AG.3]

Thanks Bruce.