We are designing a 6-layer PCB with limited board area. The layer stackup is as follows: TOP / GND2 / SIGNAL / POWER / GND5 / BOTTOM.
Due to space constraints, we are planning to place one STPM33 on the TOP side of the board, and another STPM33 rotated 90 degrees directly on the opposite BOTTOM side. Similarly, one STPM34 will be placed on the TOP side, with another STPM34 rotated 90 degrees directly beneath it on the BOTTOM side.
In summary, the board will carry a total of four ICs: one STPM33 and one STPM34 on the TOP side, and one STPM33 and one STPM34 on the BOTTOM side, with each TOP-side IC having its counterpart placed directly behind it on the BOTTOM side.
Please find attached a diagram illustrating the top/bottom placement of the STPM34. Key points of this layout are as follows:
- The power supply pin traces on the TOP and BOTTOM sides are routed nearly overlapping each other.
- The crystals on the TOP and BOTTOM sides are offset from each other so they do not overlap.
We would like to ask the following:
- Is this placement approach feasible from a device characteristics standpoint?
- Are there any concerns or PCB layout precautions we should be aware of regarding this configuration?
