Dear all，
Recently, when we were using STM32G071CBT6TR, we discovered some IC bent leads issues. At present, we have not found IC bent leads issues in the original packaging.
We are investigating the risk points. Meanwhile, we have also checked the PCN of the materials. The carrier tape has changed New Carrier Tape with 4-side partial fence design
But before PCN, we didn't have this problem, and now with the New Carrier Tape with 4-side partial fence design, some IC bent leads issues have emerged.
Could you help answer some of our questions：
1. What suggestions are there for the use of New Carrier Tape to avoid IC bent leads issues？
2. During the production of this IC, will IC bent leads issues be checked one hundred percent？
Looking forward to your reply. Thank you!
