Temperature vs efficiency curve and MTBF data for SPV1040

[shalinich67]

We are currently evaluating the following STMicroelectronics IC for our application:
SPV1040TTR

As part of our reliability and performance assessment, we kindly request your support in providing:

1. Temperature vs. efficiency curves across the specified operating temperature range
2. MTBF (Mean Time Between Failures) data or estimated MTBF hours for the above-mentioned ICs

[Peter BENSCH · Accepted solution]

You have already created a ticket with the internal ticket number 00254037 today, and I would ask you to wait for a response from that team. The community will not really be able to help you with your question, as it is a global forum for mutual assistance between users.

Thank you for your understanding and patience.

Regards
/Peter

[shalinich67]

Can I get the related information please

[Peter BENSCH]

As I can see now, the OLS team has referred you to the community, which is definitely not correct. However, I can already say that an NDA (Non Disclosure Agreement) is necessary to get MTBF data, which definitely has to be handled via the OLS.

However, regarding your first question, I cannot give you any hope of obtaining efficiency curves, especially over temperature, because this depends on a great many external parameters. Among other things, the number of cells to be charged plays a very important role. The device was launched on the market back in 2010, so the probability of such a data sheet supplement is virtually zero.

Regards
/Peter

[shalinich67]

Can you atleast provide with the junction to case thermal resistance (Rthjc) for the IC.

Thanks.

[Peter BENSCH]

Actually, this does not directly relate to the original topic and would require a separate thread. Nevertheless, I will briefly address your new question:

Because for a small plastic package like TSSOP‑8 without exposed pad, the heat path to the ambient is dominated by junction > leadframe > pins > PCB > ambient, not by junction > case (top). In that situation Rthjc​​ (junction-case, usually to the top surface) is poorly defined, not very useful for real applications and easily misleading.

ST therefore specifies only Rthj-ambient, measured on a standard PCB, because this reflects the realistic use case: the part soldered on a board where the PCB copper does most of the cooling. The value for Rthja is specified in the data sheet and is 135K/W.

Hope that answers your additional question?

Regards
/Peter