Does anyone know if the LIS2DH12 is ok in a molded application? We have one where we are putting it in a device completely encased in low-pressure molded rubber. The issue we are seeing is that at power up, sometimes the sensor doesn't power up properly and draws a significant amount of current (up to 1.2mA). Re-power it and works fine. If they power up correctly, they work great. If they don't then the unit will never wake from sleep. The sensor is programmed to generate an interrupt on movement.
The biggest issue is that as soon as we cut back the rubber, it is very difficult to get them to fail.
Temperature during molding is about 165 degrees F, so heat shouldn't be an issue. Material is not conductive, so should be no issues there.
Looking for ideas. One thought someone had was that material shrinkage while cooling was causing issues with the sensor.
