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The new STM32WBA2 for cost-and energy-sensitive wireless applications

Maxime_MARCHETTO1
Community manager

The STM32WBA2 extends the STM32WBA family with a more integrated, cost-effective MCU for low-power wireless devices. 

As the most affordable STM32 wireless MCU supporting Bluetooth® LE and IEEE802.15.4, it adds improved wireless features and new communication interfaces while staying fully compatible with existing products.  

Powered by an Arm® CortexM33 at 64 MHz, it provides a compact and efficient platform for flexible wireless applications. 

Improved wireless performance for robust IoT designs 

  • Highperformance radio delivering stable connectivity with +10dBm max output power 
  • Supports Bluetooth® LE, Zigbee, and Thread for broad protocol compatibility 
  • Programmable Tx power in 1 dB steps to precisely tune energy consumption and extend battery life 
  • Flexible powercontrol leveraging ultra-low-power STM32 MCU architecture for longer battery life  


Cost-effective platform with more integration
 

  • 512Kbytes of flash and 96Kbytes of RAM to support both your application and connectivity stacks 
  • USBFS and Q-SPI with XiP and on-the-fly decryption for richer connectivity and memory expansion options 
  • Compact package options: QFN48, QFN32, WCSP37 
  • 2layer PCB support to simplify layout and reduce BOM costs 
  • Pin-to-pin compatibility with existing STM32WBA products for easy scaling and migration 

 

Streamlined development 

  • Supported by the STM32Cube ecosystem, offering dedicated middleware, tools, extensive documentation, and application examples  
  • RF reference designs, IPD chip, and optional external PA enabling Tx power boosts up to +20dBm 


Advanced security features for regulatory compliance
 

Targeting SESIP3 and PSA Level 1 certification, STM32WBA2 provides strong security foundations to help developers address upcoming requirements from RED, CRA, and the US Cyber Act. A secure firmware update capability helps developers ship long-lasting, compliant products with confidence. 

Additional resources


First published on Feb 25, 2026

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