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Power dissipation and thermal resistance details required

VA.7
Associate

‎2019-09-17 07:21 AM

We are using "M41T80M6F" and "LM239ADT" in our design.We require power dissipation of this ic under typ,min and max conditions for thermal analysis.Also require "RθJB-Thermal resistance between Junction to Board",RθJC-Thermal resistance between Junction to Case ,RθJA-Thermal resistance between Junction to Ambient and Tjmax-Junction temperature.

 which is not available in the datasheet.Kindly help us to get the same asap.

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1 REPLY 1
Eleon BORLINI
ST Employee

‎2019-09-17 08:45 AM

Hi @VA.7​ , I suggest you to try to post the question in Analog And Audio community [added topic]. Regards

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