We are using "M41T80M6F" and "LM239ADT" in our design.We require power dissipation of this ic under typ,min and max conditions for thermal analysis.Also require "RθJB-Thermal resistance between Junction to Board",RθJC-Thermal resistance between Junction to Case ,RθJA-Thermal resistance between Junction to Ambient and Tjmax-Junction temperature.
which is not available in the datasheet.Kindly help us to get the same asap.
