Hello,
I would like to ask about the UFQFPN32 package footprint for the STM32G491KEUx device.
We are using the following part:
- Part number: STM32G491KEUx
- Package: UFQFPN32
While reviewing the datasheet and package information, we found that the actual UFQFPN32 package appears to have an exposed pad (EP) on the bottom side of the package.
However, in the datasheet/package information we reviewed, the UFQFPN32 package information and footprint example do not seem to include the EP or the EP land pattern.
In particular, the UFQFPN32 package information is shown in the document from page 166 to page 168, but we could not find any information regarding the exposed pad or the recommended PCB land pattern for the EP.
Could you please confirm the following?
- Is the exposed pad information for the STM32G491KEUx UFQFPN32 package omitted from the datasheet/package information?
- For actual PCB design, should we include an EP land pattern for the UFQFPN32 package?
- If the EP land pattern should be included, should it be connected to GND?
- Is there any recommended land pattern or application note for the UFQFPN32 package including the exposed pad?
We would appreciate your clarification, as we need to confirm the correct PCB footprint before proceeding with our board design.
Thank you.
