Hi, I got material compliance from Silicon Expert Database. Concerned part is an IC. According to Silicon Expert, there is glue used for die attach. The glue contains a phthalate based substance, DBP. DBP use is restricted by EU RoHS directive, via delegated directive 2015/863. There shall be not more than 0,1% w/w of this phthalate in homogenous material in an EEE (i. e. in the IC which is integrated into an EEE). Problem: the glue contains more DBP than allowed by EU RoHS directive. It´s about 0,2 %, not 0,1 %. Actually, it´s mikrograms per IC. But it is exceeding the threshold. - QUESTION: What happens with DBP in such glue? Does it evaporate when the glue material hardens? I. e. is there no DBP remains in the IC when it is distributed? - I am grateful for helpful hints.
