We are experiencing poor quality solder joints on our Teseo-LIV3F parts. When reflowing our boards, the Teseo-LIV3F's crystal is coming off.
Our process requires that the board is baked twice, once per side. Since the Teseo-LIV3F's crystal often has weak cold solder joints, it has a high likelihood of falling off (around 80%) when the board is heated with the Teseo-LIV3F facing down.
The concentration of other components on our PCB necessitate that we run the boards through the chamber in this order. We do not expect ST's Teseo-LIV3F to have poor quality solder joints in it.
See the photos attached.
Please help us remedy this issue.
