Wire Bond Lengths Inside BGA

I don't know the answer but probably no. BGA (and WLCSP) are not wire-bonded; rather, there's a redistribution layer between the chip itself and the outward balls. Think of a thin PCB.

Please note that this is a primarily user-driven forum, with only casual ST presence. For answer of such a specific question, you might need to contact ST directly, through FAE or web support form.

JW