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STM32H743XIH6 芯片背�?�有水�?�,有划痕,请问是原厂工艺问题导致的�?�? 是原厂出厂就存在的�?�?

满陈.1
Associate

0693W00000WINQ1QAP.jpg0693W00000WINQaQAP.pngSTM32H743XIH6  芯片背�?�有水�?�,有划痕,请问是原厂工艺问题导致的�?�? 是原厂出厂就存在的�?�?平时是真空�?存的,今天拆包�?��?�现有上�?�两�?情况,请帮忙解答�?

1 REPLY 1
FBL
ST Employee

Hello 满陈.1,

Could you please reformulate in English. This is one of our standards on How to post.

So that we can help you.

I referred to this translation. Please correct if mistaken, I quote:

"There are watermarks and scratches on the back of the STM32H743XIH6 chip.

Is it caused by the original factory process problem? Is it from the original factory?

It is usually stored in a vacuum.

Today, after unpacking, I found the above two situations. Please help!"

I suggest referring to your local sales referrals.

> "It is usually stored in a vacuum. "

Please consider the environmental conditions of the product as described in Datasheet. Otherwise, we cannot help.

To give better visibility on the answered topics, please click on Accept as Solution on the reply which solved your issue or answered your question.


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