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PTipp
PTipp
Associate
December 8, 2020
Question

Could Tech Support provide the solder profile for STM32L4R9ZIJ6 (UFBGA144) ?

  • December 8, 2020
  • 2 replies
  • 916 views

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This topic has been closed for replies.

2 replies

Imen.D
ST Technical Moderator
December 10, 2020

Hello @PTipp​ ,

I advice you to review this AN2639, it may help you: Application note Soldering recommendations and package information for Lead-free ECOPACK MCUs and MPUs.

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Imen

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PTipp
PTippAuthor
Associate
December 10, 2020

Imen: STM32L4R9ZIJ6 is the UFBGA144 package and has the half bump solder ball. We have had an on-going solder issue and have tried several solder profiles including a 10 zone reflow oven. Is the UFBGA144 available with full bump solder balls?

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