Could Tech Support provide the solder profile for STM32L4R9ZIJ6 (UFBGA144) ?

[Imen.D]

Hello @PTipp​ ,

I advice you to review this AN2639, it may help you: Application note Soldering recommendations and package information for Lead-free ECOPACK MCUs and MPUs.

Please mark my answer as best by clicking on the "Select as Best" button if it fully answered your question. This will help other users find this solution more quickly.

Imen

[PTipp]

Imen: STM32L4R9ZIJ6 is the UFBGA144 package and has the half bump solder ball. We have had an on-going solder issue and have tried several solder profiles including a 10 zone reflow oven. Is the UFBGA144 available with full bump solder balls?