STM32 products and hardware tools

The STPMIC25 power-management IC for STM32MP2 microprocessors is now available, with 16 channels to supply all the MPU power rails as well as system peripherals in one convenient package. Completing the hardware design requires only a small number of external components to provide filtering and stabilization and the STEVAL-PMIC25V1 evaluation board is available now to start development immediately. The IC contains seven DC/DC buck converters and eight low-dropout (LDO) regulators, with an additional LDO to provide the reference voltage (Vref) for system DDR3 and DDR4 DRAMs. Among the eight LDOs is a dedicated 3.3V channel to supply USB High-speed and Type-C PHY ICs. There are also general-purpose LDOs that can be assigned to power circuitry such as memory card interfaces and Ethernet ports.  The buck converters are optimized to power the MPU’s CPU, core circuitry, GPU, I/O and analog domains, with additional channels for DDR RAM supply and a general-purpose auxiliary output. The conver

The new STM32WB05 and STM32WB06/07 lines enrich the first STM32WB09 line released in 2023, expanding options for developers looking for a cost-effective, entry-level wireless solution for their embedded devices. The STM32WB0 microcontrollers support Bluetooth® Low Energy 5.4, including the new periodic advertising with responses (PAwR) feature for large-scale, low-power bidirectional networks. ST is also introducing an STM32WB05xN network processor. The STM2WB0 series is an evolution of the BlueNRG-LP and BlueNRG-LPS wireless SoC series and they share the same DNA. Developers can now harness the capabilities of the STM32Cube ecosystem and use the same software development framework across the STM32WB and STM2WBA series. Project migration across the STM32WBx portfolio is thus simple and straightforward to give users all the applicative flexibility they need. The STM32CubeWB0 software package provides several examples, including example codes for the PAwR feature. The latest example of t

The EVLSPIN32G4-ACT edge AI motor drive reference design simplifies the creation of smart actuators. This design is based on the STSPIN32G4, a 3-phase motor driver for advanced motor control systems. It is designed to work with ST's STWIN.box (STEVAL-STWINBX1), a wireless industrial sensor node, to fast-track the development of systems that merge precise motor control with real-time environmental data analysis and IoT connectivity. The EVLSPIN32G4-ACT brings together motor control advancements with data science to enable the creation of high-performance systems. It leverages the STWIN.box's sensors to monitor actuator engines, while its rapid data-logging capabilities facilitate the development of edge AI and machine learning solutions. This allows for comprehensive system monitoring, anomaly detection, and data-driven optimization. At the core of the EVLSPIN32G4-ACT is the STSPIN32G4, which integrates a gate driver, power management, and the STM32G4 microcontroller. The board supports

The STM32U5F9/G9 and STM32U5F7/G7 MCUs offer 3 MB of on-chip dynamic storage. This SRAM means they can manage several frame buffers for graphics displays, reducing the need for more memory components. The microcontrollers come equipped with ST's NeoChromVG graphics processor (GPU), which is capable of delivering the kind of graphical effects you would normally expect from more costly, high-end microprocessor units. Equipped with NeoChromVG, these STM32U5 microcontrollers are the first to offer hardware support for vector operations, enabling the rendering of SVGs and vector-based fonts. NeoChromVG GPU facilitates advanced graphical effects, including rotation, alpha blending, and texture mapping with precise perspective correction. These MCUse also come with a JPEG codec capable of processing MJPEG videos. Integrating all circuitry inside the MCUs’ low-cost 100-pin quad-flat package allows a simple 4-layer PCB design to avoid the usual challenges associated with signal routing and elec

The LSM6DSV32X 6-axis inertial module has an accelerometer full-scale range of 32g and 4000 degrees-per-second gyroscope to measure intensive movements and impacts, such as freefall height estimation. Ready to drive future generations of edge AI applications, the new sensor device enables extra features and longer battery runtime in consumer wearables, asset trackers, and impact and fall alarms for workers. The LSM6DSV32X is the latest addition to ST's intelligent sensor series featuring a machine-learning core (MLC) with AI-powered decision trees. This sensor combines MLC for recognizing contexts and a finite state machine (FSM) for motion detection, enabling developers to enhance product capabilities while reducing response times and conserving energy. The LSM6DSV32X is particularly efficient, requiring less than 6µA for gym activity detection and only 30µA for 3D orientation tracking, thanks to ST's sensor fusion low-power (SFLP) algorithm. It also features adaptive self-configurati

ST has launched a compact System-in-Package module for long-range connectivity, the pre-certified STM32WL5MOC, which is poised to accelerate the deployment of IoT devices in smart homes and buildings. This module is built around the dual-core STM32WL55JC wireless system-on-chip (SoC), designed to reduce material costs and boost time to market for remote metering, monitoring, and smart-sensing devices by enabling straightforward LPWAN wireless connectivity. Hosted in a 10 x 10 mm LGA92 package, the STM32WL5MOC SiP integrates the SoC with crucial RF components such as frequency-controlled oscillators, a balun, filter, matching network, a receive/transmit switch, and the passives required for operation. This integration allows users to bypass the complexities of RF design, saving space and simplifying circuit layout, which cuts down on the time and expertise needed for sophisticated RF design and certifications. The module excels in long-range data communication with minimal power usage,