What is the currect sequence of producing all boot artifacts(TF-A, Optee, U-boot)?
Hi,
I am currently using ST’s OpenSTLinux distribution, version 6.2.1, for our STM32MP135F-based custom board.
My objective is to customize the boot and operating system components—TF-A, OP-TEE, U-Boot, and the Linux kernel—to meet our board-specific requirements. Boot media is emmc.
I have successfully set up the Yocto build environment and can build the complete image. However, to reduce development and debugging time, I would like to build these components individually rather than rebuilding the entire image after every change.
I have also set up the environment for building and installing these boot artifacts separately. I would appreciate your guidance on the correct build and deployment sequence, including which source files, configuration files, device trees, and generated binaries are required at each stage.
Could you please clarify the recommended workflow for building, integrating, and flashing TF-A, OP-TEE, U-Boot, and Linux independently while ensuring compatibility with ST’s OpenSTLinux 6.2.1 release?