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Associate III
June 25, 2026
Question

STM32WB55CGU6 custom board: ST-LINK cannot detect target, low current consumption, PA10 output weak

  • June 25, 2026
  • 2 replies
  • 29 views

Hello,

I designed a custom 4-layer PCB using STM32WB55CGU6. After assembly, ST-LINK cannot detect the MCU.

ST-LINK connection:
- SWDIO connected to MCU SWDIO pin
- SWCLK connected to MCU SWCLK pin
- GND connected
- Target VCC connected
- ST-LINK reports target voltage around 3.25 V
- Error message:
  "Unable to get core ID"
  "No STM32 target found"

Main symptoms:
1. The board has 3.25 V on the 3V3 rail.
2. ST-LINK cannot connect to the MCU.
3. PA10 is configured as GPIO output high to drive LED1, but PA10 voltage is only about 2.18 V.
   - R8 MCU side: 2.18 V
   - R8 LED side: 2.15 V
4. The same firmware works on another known-good board.
5. I replaced the STM32WB55CGU6 with a known-good chip, but the issue remains.
   The removed chip still works on another board, so the MCU itself does not seem damaged.
6. Current consumption comparison:
   - Known-good board: about 23 mA
   - Problem board: about 9.2 mA
   - Known-good board while holding RESET: about 12 mA
   - Problem board while holding RESET: about 3 mA
7. The non-GND side of C13, which is connected to the STM32WB55CGU6 VFBSMPS pin, is about 3.25 V on both the known-good board and the problem board.
8. SWDIO and SWCLK continuity from ST-LINK connector to MCU pins has been checked with a multimeter.

Known design issue found:
PB4 was accidentally connected to the battery/LDO input power net. I cut the trace between PB4 and that power input net, but the current consumption and ST-LINK issue did not change. Therefore I think PB4 is a design mistake, but maybe not the main cause of the current issue.

Things I suspect:
- STM32WB55CGU6 UFQFPN48 soldering issue
- exposed pad / thermal pad soldering issue
- possible solder wicking through vias under the exposed pad
- some VDD / VDDRF / VDDSMPS / VDDUSB pin not properly soldered
- SWD not working because the MCU is not starting correctly

Questions:
1. From the schematic and Gerber files, do you see any issue that would prevent STM32WB55CGU6 from starting or being detected by ST-LINK?
2. Is my power supply scheme for STM32WB55CGU6 correct?
3. Could the exposed pad vias or QFN soldering cause this kind of symptom: 3.3 V present, low current, PA10 weak output, and ST-LINK unable to get core ID?
4. Is connecting PB4 to the battery/LDO input net likely to permanently damage the MCU, or would it mainly cause leakage/back-powering/conflict depending on GPIO state?
5. What measurements should I perform next to distinguish between PCB design issue and assembly/soldering issue?

I have attached:
- schematic PDF

2 replies

Associate III
June 25, 2026

schematic PDF

Andrew Neil
Super User
June 25, 2026

 

A complex system that works is invariably found to have evolved from a simple system that worked.A complex system designed from scratch never works and cannot be patched up to make it work.
Associate III
June 27, 2026

Thank you.

One important symptom is that the current consumption is much lower than a known-good board.

Known-good board: about 23 mA Problem board: about 9 mA Known-good board while holding RESET: about 12 mA

Problem board while holding RESET: about 3 mA The 3.3 V rail is stable at about 3.25 V, and ST-LINK also detects this target voltage, but it cannot get the core ID.

So my main question is: does this lower current consumption suggest that the STM32WB55 is not starting correctly due to a PCB design or assembly issue?

For example, an issue with VDD/VDDRF/VDDSMPS/VDDUSB/GND pins, exposed pad soldering, or SWD pin soldering?