Bonding fails

[gocchan]

Hello, 

I'm developing software for the STM32WBA2. Bonding is a required feature of this project, so I've set the bonding-related parameters as follows:

 

CFG_BONDING_MODE: Bonding mode (0x01)
CFG_ENCRYPTION_KEY_SIZE_MAX: 16
CFG_ENCRYPTION_KEY_SIZE_MIN: 8
CFG_IO_CAPABILITY: Display Yes No (0x01)
CFG_MITM_PROTECTION: MITM protection required (0x01)
CFG_SC_SUPPORT: Secure Connections Pairing supported but optional (0x01)
CFG_KEYPRESS_NOTIFICATION_SUPPORT: Keypress notification not supported (0x00)

 

I've also attached app_conf.h and ble_conf.h.
However, when I connect using ST BLE Toolbox and press the Bond button, the Bluetooth connection is lost.
What could be the cause?
Is it possible to view communication logs using ST BLE Toolbox?

 

Best regards, 
Gotoda
 

[Imen.D]

Hello ​@gocchan ,

You'll probably want to review these resources that may help you on your application :

• STM32WB-WBA Bluetooth® LE Security - stm32mcu
• Guidelines for Bluetooth® LE stack programming on STM32WB/STM32WBA MCUs - Programming manual
• STM32CubeWBA/Projects/NUCLEO-WBA25CE1/Applications/BLE/BLE_Security_Peripheral at main · STMicroelectronics/STM32CubeWBA · GitHub

I will try to contact expert internally to help you.