What does an STM32L452, LQFP48 package look like before it is encapsulated?
I’m designing another PCB for the STM32L452 LQFP48, and I was wondering - how big is the die? Can I see a picture of the structure of the LQFP 48 before it is encapsulated?
I use double layer boards, and have as much ground plane under the micro, both top and bottom layer as possible. But I often sneak some power tracks around the inside perimeter of the micro. But under the plastic goo I do not know how big the die is. How far can I go with tracks before I am under the actual microprocessor? I think knowing the internal dimensions of the package would help me fine tune my printed circuit board designs.
I suppose I could destroy one to find out, but that seems like a waste (and messy). I can’t imagine it would be company confidential… or could it? If a photo is confidential, how about a CAD drawing? … or maybe an artist’s impression...
