Unavailability of Exposed pad for STM32L031x4/6 in UFQFPN28 package

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There is a note for UFQFPN32 package, that says "There is an exposed die pad on the underside of the UFQFPN package.", But there is no similar statement for UFQFPN28 package for the same device. Is it intentional or missed or if there is any plan to add if it is intentional?

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STTwo-32Best answer

ST Technical Moderator

Hello @saochandan

This note concern only the UFQFPN48 and the UFQFPN32. The UFQFPN28 package is not concerned by the exposed pad so this note is not applicable in this case.

Best Regards.

STTwo-32

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