Question
STM32 "Bulletproof" Application Fail Safes (BOR, WDT, etc)
I have an application which I’m trying to make absolutely “bulletproof�?, so I’m trying to imagine and handle absolutely every possible failure scenario (specifically this query relates to hardware failure scenarios rather than software bugs).
I was wondering what happens on the STM32 in the following scenarios?
- One or more VDD/VSS/VDDA/VSSA pins lose connection (e.g. dry joint), whilst other VDD/VSS/VDDA/VSSA pins still have good connection.
- Same as above, but for VCAP pins.
Would either of these scenarios be handled by POR/BOR, and what would the behaviour of the IWDT be in these scenarios? Is there any scenario where the MCU could potentially "hang" without this being caught by the IWDT?
Thanks in advance for any insight! :)
