Regarding Case to ambient Thermal resistance information/ case temperature information

[cgedd]

Hi sir/ mam,

we are using STM 32f765NIH7 micro controller for our industrial safety project. we just want to know about thermal resistance between case and ambient or please provide max case temperature , so that it's helpful for our derating calculation and SFF calculation

[S.Ma]

Datasheet info not detailed enough?

https://www.st.com/resource/en/datasheet/stm32f765ni.pdf

Page 250

Ageing of the chip typically shrink with higher junction temperature.

[cgedd]

Hi thanks for your reply but in datasheet they mentioned junction to ambient R tetha Ja but we want to know case to ambient R tetha Jc. Can you please help me out where we will get that info.

[Khouloud GARSI]

Hi @cgedd​ ,

I would recommend to check with your FAE to get more details about this request.

Khouloud.

[S.Ma]

The only other info is page 113 about junction temperature limit to wakl back to max ambiant temperature. (if the application has a plastic case and heating occurs inside...) In an LCD TV, chassis ambiant is typically 60 to 80C.

TA Ambient temperature for 6 suffix version Maximum power dissipation − 40 - 85 °C Low power dissipation(10) − 40 - 105 Ambient temperature for 7 suffix version Maximum power dissipation − 40 - 105 °C Low power dissipation(10) − 40 - 125 TJ Junction temperature range 6 suffix version − 40 - 105 °C 7 suffix version − 40 - 125

I'm not expert in thermal calculations, someone more knowledgeable should answer in more details to the question.