Power dissipation calculation for STM32N657X0H3Q

[kadam]

Hello Team,

We are planning to use MCU P/N: STM32N657X0H3Q for our new design. We want to perform thermal simulation. 

Could you please help us for how to calculate power dissipation?

Thanks.

[mƎALLEm]

Hello,

I suggest to refer to the AN5036 "Guidelines for thermal management on STM32 MCUs and MPUs "

[kadam]

Hello,

Could you please help us to understand power dissipation calculation from junction temperature (TJ (°C))
and current consumption? We are referring table "Table 4. STM32H747XI power dissipation versus Tj" in AN5036 application note. Also, we are referring internal Temperature Sensor (TS0 and TS1) for junction temperature estimation.

Thanks,

 

 

 

 

[Bowman32]

Why are you referring to Table 4? It is for the STM32H747XI.

If you are using the STM32N657X0H3Q, you should refer to section 6.5 Discovery kit with STM32N657X0H3 MCU.

1) The thermal model of STM32N657X0H3Q

For thermal simulation, you can use 2R thermal model θJB (junction-to-board) and θJC (junction-to-case) in the datasheet.

2) Power estimation 

Power estimation depends on the use case including, PCB size and nbr of layer, copper % ... other component on the board ... and depend also on VDD, Freq.... The power consumption on section 6.5 is presented as test use case example for the discovery board.