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Pchal.1
Pchal.1
Visitor II
December 11, 2020
Question

I am using STM32H745ZIT6 device in my design .want to do thermal analysis for the particular part . what is the power dissipation of the device and how to do?

  • December 11, 2020
  • 2 replies
  • 652 views

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2 replies

TDK
TDK
December 11, 2020

Power dissipated is voltage times current (for the current used within the device). Current will vary depending on what your chip does. The datasheet includes thermal characteristics of the package.

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Amel NASRI
Amel NASRI
Technical Moderator
January 4, 2021

Hi @Pchal.1​ ,

Best Wishes for this New Year!

I assume that you can find an answer to your question in AN5036 ( Thermal management guidelines for STM32 applications).

It provides recommendations for efficient thermal analysis on STM32 applications like how to optimize thermal dissipation.

As example, a thermal analysis has been done on a Discovery kit with a STM32H747XI device (STM32H747I-DISCO) and results are shared in this document.

-Amel

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