Can ROHS BGA be used with SnPb solder?
It's my understanding that it is a bad idea to mix lead-free and leaded solder, and that it can cause cracks.
I'm using a TFBGA100 package on an STM32H7 and have some long-term reliability requirements. In order to avoid tin-whiskers, I was considering using SnPb (leaded) solder.
But then I started wondering, if the TFBGA uses collapsing solder balls, and the device is lead-free, wouldn't this cause issues with the leaded solder? The balls would be lead-free and the solder on the board would be leaded?
Does anyone have experience with this?