Thermal dissipation concerns for EVLSTGAP3SXS-H

[exothermiic]

Is there a recommended heat sink for EVLSTGAP3SXS-H? I would like to continuously run the device at 10 A but there are no heatsinks or clear thermal paths on the board. 

[AScha.3]

The “ recommended” heat sink depends on the load .

So you have to calculate the power loss in the SiC with the conditions you will use them,

and then the needed heat sink at the expected ambient temp.

Same procedure as always.

And don't forget the isolated mounting and the needed safety gaps , depending on the voltage you wanna use.

+

>there are no heatsinks or clear thermal paths on the board. 

Right, as its for evaluation of the driver STGAP3 , not a ready made power board.

in ds you can see the intended size of heat sink that fits on the board :

• maybe a small cpu-cooler with fan could fit ...

+

If you want drive 10A out at (?) frequency, the DC-link cap C4, ECWFG1B335J, has 6.7 A permissible current max. , so you need more or better dc-link caps anyway.

 

 

btw

I use the STGAP3 on a SiC inverter, 15kW , 400 VAC in.  , up to 200kW with paralleled boards.