Soldering Profile requirements for SPV1050

[damayn]

Hi all,

Ive been hand-populating prototype boards around an SPV1050 and for 2 out of 2 boards so far I’ve noticed the SPV1050 being defective right from the beginning. I then replaced the IC  via hot air rework and it worked flawlessly. That makes me wonder if my soldering setup kills the IC.

Im using chipquik low temp soldering paste (the syringe is pretty empty, so it is far from fresh) and a Mini Heat plate with the default profile:

1. 80 sec rise to 150°C
2. 80 sec rise to 170°C
3. 60 sec rise to 230
4. 90 sec keep at 230°C for soldering
5. slow cooldown

Are there any AN’s for this IC regarding soldering? I could nto find any info…

Thank you for reading

 

BR

Damian

 

[Peter BENSCH]

Welcome ​@damayn, to the community!

There can be many reasons why the two soldered devices are not working: short circuits, flux residues, overheating, etc.

As for the temperature profile, this has been defined for many years by JEDEC in the JEDEC J-STD-020 standard, which all manufacturers, including ST, follow. You can find the PDF of the standard by searching for J-STD-020 on jedec.org, and you can access it after logging in there.

Hope that helps?

Regards
/Peter