Request for RθJA and Tj(max) – LSM6DSOXTR
Dear STMicroelectronics Community,
I am performing a thermal analysis for the following component:
MPN: LSM6DSOXTR
Package: LGA-14L, 2.5 mm × 3.0 mm
Could you please provide the following thermal parameters for this exact MPN and package?
- Junction-to-Ambient Thermal Resistance, RθJA (°C/W)
- Maximum Junction Temperature, Tj(max) (°C)
Please also provide the PCB/test conditions associated with the RθJA value, if available.
If RθJA or Tj (max) is specified in a separate package thermal document, application note, or internal technical document that can be shared with customers, please provide the relevant document/reference.
Thank you.
Best regards,
Bajas.
