VB1943 / VB5943 OBGA: recommended PCB land pattern, stencil and MSL?

[janj]

Hello,

I am designing a PCB with the VB1943 / VB5943 in the OBGA package (DS14880 / DS14968 Rev 3). The datasheets give the package drawing (0.8 mm pitch, Ø0.52 mm balls) but no recommended PCB land pattern. Could you share:

1. the recommended pad diameter and type (SMD or NSMD) and the solder mask opening;
2. the stencil aperture and thickness;
3. the MSL level, bake conditions and maximum number of reflow cycles, and whether a second-side reflow with the sensor on the bottom side is allowed?

I am currently assuming an NSMD pad of Ø0.40 mm with a Ø0.50 mm mask opening. Is that in line with ST’s recommendation?

Two related questions on the datasheet:

4. The Rev 3 revision history says “Ball assignment (see-through view): updated ball referencing”. What exactly changed compared with Rev 1/2, and is Table 6 of Rev 3 final?
5. What is the nominal distance from the seating plane (ball tips) to the focusing plane, and the cover glass thickness and refractive index? Fig. 32 gives 1.02 ± 0.075, 1.84 ± 0.09 and 2.05 ± 0.15 mm, but the notes they refer to are not in the datasheet.

Thank you!