Developer news

The EVLSPIN32G4-ACT edge AI motor drive reference design simplifies the creation of smart actuators. This design is based on the STSPIN32G4, a 3-phase motor driver for advanced motor control systems. It is designed to work with ST's STWIN.box (STEVAL-STWINBX1), a wireless industrial sensor node, to fast-track the development of systems that merge precise motor control with real-time environmental data analysis and IoT connectivity. The EVLSPIN32G4-ACT brings together motor control advancements with data science to enable the creation of high-performance systems. It leverages the STWIN.box's sensors to monitor actuator engines, while its rapid data-logging capabilities facilitate the development of edge AI and machine learning solutions. This allows for comprehensive system monitoring, anomaly detection, and data-driven optimization. At the core of the EVLSPIN32G4-ACT is the STSPIN32G4, which integrates a gate driver, power management, and the STM32G4 microcontroller. The board supports

STPOWER MDmesh DM9 AG automotive-grade 600V/650V super-junction MOSFETs deliver high efficiency and ruggedness for on-board chargers and DC/DC converters in both hard- and soft-switching topologies.  The standout feature of the MDmesh DM9 AG series is its RDS(on) per die area coupled with a minimal gate charge. This combination leads to lower energy losses and superior switching performance, setting a new benchmark figure of merit. The latest technology in the series ensures a tighter gate-source threshold voltage (VGS(th)) spread, which sharpens the switching capabilities of the MOSFETs, resulting in lower turn-on and turn-off losses. Moreover, these devices offer improved body-diode reverse recovery characteristics, thanks to a new optimized process that not only enhances the reverse recovery but also increases the MOSFETs' overall ruggedness. The diode's low reverse-recovery charge (Qrr) and fast recovery time (trr) position the MDmesh DM9 AG series as an ideal choice for phase-shif

The STM32U5F9/G9 and STM32U5F7/G7 MCUs offer 3 MB of on-chip dynamic storage. This SRAM means they can manage several frame buffers for graphics displays, reducing the need for more memory components. The microcontrollers come equipped with ST's NeoChromVG graphics processor (GPU), which is capable of delivering the kind of graphical effects you would normally expect from more costly, high-end microprocessor units. Equipped with NeoChromVG, these STM32U5 microcontrollers are the first to offer hardware support for vector operations, enabling the rendering of SVGs and vector-based fonts. NeoChromVG GPU facilitates advanced graphical effects, including rotation, alpha blending, and texture mapping with precise perspective correction. These MCUse also come with a JPEG codec capable of processing MJPEG videos. Integrating all circuitry inside the MCUs’ low-cost 100-pin quad-flat package allows a simple 4-layer PCB design to avoid the usual challenges associated with signal routing and elec

The ST60A3H0 and ST60A3H1 offer a new wireless solution to replace cables in electronic devices. These transceivers remove the need for cables and connectors in consumer and industrial applications.  The ST60A3H0 and ST60A3H1 are cost-effective, enabling designers to create products with slim, stylish cases that are water-resistant and support wireless docking. They feature self-discovery for instant connection, eliminating the need for manual pairing, and their low power consumption preserves battery runtime. Operating in the 60GHz V-band, these transceivers offer multiple connectivity options including eUSB2, I2C, SPI, UART, and GPIO tunneling. Energy efficiency is a key attribute, with the transceivers using only 130mW in eUSB rx/tx mode and 90mW for other modes, alongside a 23µW shutdown mode. They support high-speed data exchange up to 480Mbit/s, aligning with USB 2.0 High Speed specifications, ensuring fast and responsive wireless connections. The ST60A3H1 model includes an integ

The LSM6DSV32X 6-axis inertial module has an accelerometer full-scale range of 32g and 4000 degrees-per-second gyroscope to measure intensive movements and impacts, such as freefall height estimation. Ready to drive future generations of edge AI applications, the new sensor device enables extra features and longer battery runtime in consumer wearables, asset trackers, and impact and fall alarms for workers. The LSM6DSV32X is the latest addition to ST's intelligent sensor series featuring a machine-learning core (MLC) with AI-powered decision trees. This sensor combines MLC for recognizing contexts and a finite state machine (FSM) for motion detection, enabling developers to enhance product capabilities while reducing response times and conserving energy. The LSM6DSV32X is particularly efficient, requiring less than 6µA for gym activity detection and only 30µA for 3D orientation tracking, thanks to ST's sensor fusion low-power (SFLP) algorithm. It also features adaptive self-configurati

The latest-generation VL53L8CX 8×8 multizone Time-of-Flight ranging sensor delivers a range of improvements, including greater ambient-light immunity, lower power consumption, and enhanced optics.  ​ ST’s direct-ToF sensors combine a 940 nm vertical cavity surface emitting laser (VCSEL), a multizone SPAD (single-photon avalanche diode) detector array, and an optical system comprising filters and diffractive optical elements (DOE) in an all-in-one module that outperforms conventional micro lenses typically used with similar alternative sensors. The sensor projects a wide square field of view of 45° x 45° (65° diagonal) and receives reflected light to calculate the distance of objects up to 400 cm away, across 64 independent zones, and up to 30 captures per second. The new VL53L8CX boosts ranging performance with a new-generation VCSEL and advanced silicon-based meta-optics. Compared with the current VL53L5CX, the enhancements increase immunity to interference from ambient light, extendi

ST has launched a compact System-in-Package module for long-range connectivity, the pre-certified STM32WL5MOC, which is poised to accelerate the deployment of IoT devices in smart homes and buildings. This module is built around the dual-core STM32WL55JC wireless system-on-chip (SoC), designed to reduce material costs and boost time to market for remote metering, monitoring, and smart-sensing devices by enabling straightforward LPWAN wireless connectivity. Hosted in a 10 x 10 mm LGA92 package, the STM32WL5MOC SiP integrates the SoC with crucial RF components such as frequency-controlled oscillators, a balun, filter, matching network, a receive/transmit switch, and the passives required for operation. This integration allows users to bypass the complexities of RF design, saving space and simplifying circuit layout, which cuts down on the time and expertise needed for sophisticated RF design and certifications. The module excels in long-range data communication with minimal power usage,