Developer news

Are you ready to enhance your user interface design?Implementing screen transitions is a crucial aspect of creating a seamless user experience, and we're here to make it easier for you.That's why we created our latest video, "How to TouchGFX: screen transitions and performances", to guide you through implementing screen transitions effortlessly using TouchGFX. What you'll learnAdding screen transitions: whether you prefer using the TouchGFX Designer or coding directly, we've got you covered. Four unique transitions: dive deep into Slide, Cover, Wipe, and Block transitions. Performance optimization: essential tips to ensure your transitions are efficient.  Why watch this video?By the end of this video, you will be equipped with the knowledge to seamlessly integrate screen transitions into your projects, choose the right transition, and test its performance, enhancing both functionality and aesthetics.Watch our latest video.Don’t miss outExplore our other videos to further enhance your T

We are pleased to announce the release of TouchGFX 4.24.1, which includes bug fixes and improvements to enhance your development experience. TouchGFX Designer improvementsEnhanced project updater: The project updater now seamlessly updates STM32CubeIDE projects created with STM32CubeMX v6.12.0 and above. This enhancement ensures compatibility with the latest STM32CubeMX updates, providing a better experience for our users. We are pleased to have addressed the specific issues mentioned in the community threads here and here. Optimized 'Images' tab: We have refined the 'Images' tab to eliminate warnings when using an 8 bits per pixel framebuffer, particularly in the compression column. VectorFontRenderer enhancement: We have resolved a minor error in the VectorFontRenderer code when using a 1 bit per pixel framebuffer, ensuring more reliable and accurate font rendering.  TouchGFX Core enhancementsImproved font converter: The font converter now efficiently handles fonts with more than 255

The STPMIC25 power-management IC for STM32MP2 microprocessors is now available, with 16 channels to supply all the MPU power rails as well as system peripherals in one convenient package. Completing the hardware design requires only a small number of external components to provide filtering and stabilization and the STEVAL-PMIC25V1 evaluation board is available now to start development immediately. The IC contains seven DC/DC buck converters and eight low-dropout (LDO) regulators, with an additional LDO to provide the reference voltage (Vref) for system DDR3 and DDR4 DRAMs. Among the eight LDOs is a dedicated 3.3V channel to supply USB High-speed and Type-C PHY ICs. There are also general-purpose LDOs that can be assigned to power circuitry such as memory card interfaces and Ethernet ports.  The buck converters are optimized to power the MPU’s CPU, core circuitry, GPU, I/O and analog domains, with additional channels for DDR RAM supply and a general-purpose auxiliary output. The conver

Accelerating development of compact and reliable fans and pumps built with energy-efficient motors, STMicroelectronics has introduced the PWD5T60 three-phase driver with a ready-to-use evaluation board that supports flexible control strategies. Suited to applications up to 500V, the PWD5T60 integrates a gate driver and six power MOSFETs with RDS(ON) of 1.38Ω, enabling the device to achieve an outstanding energy to area rating. Zero-drop bootstrap diodes are also built-in, requiring minimal external components to complete the circuit in only 30% of the board area of an equivalent driver built with discrete components. The propagation delays of high-side and low-side MOSFETs are closely matched, which eliminates cycle distortion and maximizes flexibility to set the operating frequency for optimum response and energy efficiency. The EVLPWD-FAN-PUMP evaluation board, released at the same time, helps developers quickly explore the value this driver can deliver in projects up to 100W. The bo

The ST25TA-E NFC tag IC increases the integrity of digital product passports and blockchain-driven solutions by implementing a state-of-the-art on-chip digital signature mechanism, TruST25™ Edge.     Using elliptic curve cryptography (ECC) and running on a sophisticated asymmetric cryptographic engine within the ST25TA-E, this new on-chip signature ensures the authenticity of an attached physical object. By integrating on-chip and external digital signature mechanisms, the ST25TA-E NFC tag delivers robust protection against falsification and unauthorized market activities, while also expanding possibilities for consumer engagement. The ST25TA-E is tailored to meet the high standards of premium brands and is especially suited for safeguarding high-end merchandise like luxury apparel and accessories, artwork, or any goods requiring a digital certificate. Tapping with an NFC-enabled smartphone can trace the product's full supply chain journey to verify the provenance of each item's origin

The new VL53L4ED single-zone Time-of-Flight (ToF) sensor has an extended operating temperature range from -40°C to 105°C. Ready for harsh environments, the VL53L4ED enhances proximity detection and ranging under high ambient light conditions in applications such as industrial tools, smart-factory equipment, robot guidance systems, outdoor lighting controls, and security systems. Expanding ST’s VL53L4 family of direct-ToF sensors, the VL53L4ED integrates a laser emitter and a single-photon avalanche-diode (SPAD) detector array in a convenient all-in-one module which ensures reliable measurement even in extreme temperature conditions. The next-generation laser provides enhanced performance in high ambient light environments and excellent short-distance ranging accuracy. In addition, the sensors embed a processor that allows power-saving autonomous operation and lowers demand for host-system resources. ST’s new ToF sensor provides high-accuracy distance measurement to objects up to 1150mm

The new STM32WB05 and STM32WB06/07 lines enrich the first STM32WB09 line released in 2023, expanding options for developers looking for a cost-effective, entry-level wireless solution for their embedded devices. The STM32WB0 microcontrollers support Bluetooth® Low Energy 5.4, including the new periodic advertising with responses (PAwR) feature for large-scale, low-power bidirectional networks. ST is also introducing an STM32WB05xN network processor. The STM2WB0 series is an evolution of the BlueNRG-LP and BlueNRG-LPS wireless SoC series and they share the same DNA. Developers can now harness the capabilities of the STM32Cube ecosystem and use the same software development framework across the STM32WB and STM2WBA series. Project migration across the STM32WBx portfolio is thus simple and straightforward to give users all the applicative flexibility they need. The STM32CubeWB0 software package provides several examples, including example codes for the PAwR feature. The latest example of t

The EVLSPIN32G4-ACT edge AI motor drive reference design simplifies the creation of smart actuators. This design is based on the STSPIN32G4, a 3-phase motor driver for advanced motor control systems. It is designed to work with ST's STWIN.box (STEVAL-STWINBX1), a wireless industrial sensor node, to fast-track the development of systems that merge precise motor control with real-time environmental data analysis and IoT connectivity. The EVLSPIN32G4-ACT brings together motor control advancements with data science to enable the creation of high-performance systems. It leverages the STWIN.box's sensors to monitor actuator engines, while its rapid data-logging capabilities facilitate the development of edge AI and machine learning solutions. This allows for comprehensive system monitoring, anomaly detection, and data-driven optimization. At the core of the EVLSPIN32G4-ACT is the STSPIN32G4, which integrates a gate driver, power management, and the STM32G4 microcontroller. The board supports

STPOWER MDmesh DM9 AG automotive-grade 600V/650V super-junction MOSFETs deliver high efficiency and ruggedness for on-board chargers and DC/DC converters in both hard- and soft-switching topologies.  The standout feature of the MDmesh DM9 AG series is its RDS(on) per die area coupled with a minimal gate charge. This combination leads to lower energy losses and superior switching performance, setting a new benchmark figure of merit. The latest technology in the series ensures a tighter gate-source threshold voltage (VGS(th)) spread, which sharpens the switching capabilities of the MOSFETs, resulting in lower turn-on and turn-off losses. Moreover, these devices offer improved body-diode reverse recovery characteristics, thanks to a new optimized process that not only enhances the reverse recovery but also increases the MOSFETs' overall ruggedness. The diode's low reverse-recovery charge (Qrr) and fast recovery time (trr) position the MDmesh DM9 AG series as an ideal choice for phase-shif

The STM32U5F9/G9 and STM32U5F7/G7 MCUs offer 3 MB of on-chip dynamic storage. This SRAM means they can manage several frame buffers for graphics displays, reducing the need for more memory components. The microcontrollers come equipped with ST's NeoChromVG graphics processor (GPU), which is capable of delivering the kind of graphical effects you would normally expect from more costly, high-end microprocessor units. Equipped with NeoChromVG, these STM32U5 microcontrollers are the first to offer hardware support for vector operations, enabling the rendering of SVGs and vector-based fonts. NeoChromVG GPU facilitates advanced graphical effects, including rotation, alpha blending, and texture mapping with precise perspective correction. These MCUse also come with a JPEG codec capable of processing MJPEG videos. Integrating all circuitry inside the MCUs’ low-cost 100-pin quad-flat package allows a simple 4-layer PCB design to avoid the usual challenges associated with signal routing and elec

The ST60A3H0 and ST60A3H1 offer a new wireless solution to replace cables in electronic devices. These transceivers remove the need for cables and connectors in consumer and industrial applications.  The ST60A3H0 and ST60A3H1 are cost-effective, enabling designers to create products with slim, stylish cases that are water-resistant and support wireless docking. They feature self-discovery for instant connection, eliminating the need for manual pairing, and their low power consumption preserves battery runtime. Operating in the 60GHz V-band, these transceivers offer multiple connectivity options including eUSB2, I2C, SPI, UART, and GPIO tunneling. Energy efficiency is a key attribute, with the transceivers using only 130mW in eUSB rx/tx mode and 90mW for other modes, alongside a 23µW shutdown mode. They support high-speed data exchange up to 480Mbit/s, aligning with USB 2.0 High Speed specifications, ensuring fast and responsive wireless connections. The ST60A3H1 model includes an integ

The LSM6DSV32X 6-axis inertial module has an accelerometer full-scale range of 32g and 4000 degrees-per-second gyroscope to measure intensive movements and impacts, such as freefall height estimation. Ready to drive future generations of edge AI applications, the new sensor device enables extra features and longer battery runtime in consumer wearables, asset trackers, and impact and fall alarms for workers. The LSM6DSV32X is the latest addition to ST's intelligent sensor series featuring a machine-learning core (MLC) with AI-powered decision trees. This sensor combines MLC for recognizing contexts and a finite state machine (FSM) for motion detection, enabling developers to enhance product capabilities while reducing response times and conserving energy. The LSM6DSV32X is particularly efficient, requiring less than 6µA for gym activity detection and only 30µA for 3D orientation tracking, thanks to ST's sensor fusion low-power (SFLP) algorithm. It also features adaptive self-configurati

The latest-generation VL53L8CX 8×8 multizone Time-of-Flight ranging sensor delivers a range of improvements, including greater ambient-light immunity, lower power consumption, and enhanced optics.  ​ ST’s direct-ToF sensors combine a 940 nm vertical cavity surface emitting laser (VCSEL), a multizone SPAD (single-photon avalanche diode) detector array, and an optical system comprising filters and diffractive optical elements (DOE) in an all-in-one module that outperforms conventional micro lenses typically used with similar alternative sensors. The sensor projects a wide square field of view of 45° x 45° (65° diagonal) and receives reflected light to calculate the distance of objects up to 400 cm away, across 64 independent zones, and up to 30 captures per second. The new VL53L8CX boosts ranging performance with a new-generation VCSEL and advanced silicon-based meta-optics. Compared with the current VL53L5CX, the enhancements increase immunity to interference from ambient light, extendi

ST has launched a compact System-in-Package module for long-range connectivity, the pre-certified STM32WL5MOC, which is poised to accelerate the deployment of IoT devices in smart homes and buildings. This module is built around the dual-core STM32WL55JC wireless system-on-chip (SoC), designed to reduce material costs and boost time to market for remote metering, monitoring, and smart-sensing devices by enabling straightforward LPWAN wireless connectivity. Hosted in a 10 x 10 mm LGA92 package, the STM32WL5MOC SiP integrates the SoC with crucial RF components such as frequency-controlled oscillators, a balun, filter, matching network, a receive/transmit switch, and the passives required for operation. This integration allows users to bypass the complexities of RF design, saving space and simplifying circuit layout, which cuts down on the time and expertise needed for sophisticated RF design and certifications. The module excels in long-range data communication with minimal power usage,