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Over-molding of LSM9DS1

Question asked by RUSHI GAJJAR on Mar 22, 2018
Latest reply on Apr 5, 2018 by Miroslav B

Hi, This question is regarding the e-packaging of the LSM9DS1 sensor PCBA 

Instead of packaging it in the plastic casing, We are planning to cover the PCBA with the overmolding material to cover the whole PCB including the sensor to protect it from moisture and environment.


Is overmolding advisable over the LSM9DS1 sensor given that it is a MEMS? If yes, do you suggest any specific material and process?