We are working with the LIS2DHTR and have had significant yield issues after running the board through the reflow oven. For the next run we plan to lower the temperature. But for now we are replacing the units by hand are are still having issues.
Has anyone ever dealt with MEMs failures after reflow or rework. I have also noticed that units behave differently following rework. For instance, we are setting a threshold in software to generate an interrupt from the accelerometer. In different units, the force required to generate the interrupt can be significantly different.
Are there any tips on assembly for these parts?