STM32 MCU datasheets: Expected preliminary updates

(Nov 2024)

Figure 11. UFBGA144 ballout

Expected:

Replace M12 by VSS in figure 11

Jun 2024

STM32H562xx

and

STM32H563xx

(May 2024)

Figure x. LQFP64 pinout

Current :

- VSSA

- VDDA

Expected:

Update VSSA by: VSSA/VREF-

Update VDDA by: VDDA/VREF+

Oct 2024

STM32G071x8/xB

DS12232 Rev 4

(Sep 2021)

Table 12. Pin assignment and description

Current:

Note 3:

3. Upon reset, a pull-down resistor might be present on PB15, PA8, PD0, or PD2, depending on the voltage level on PB0, PA9, PC6, PA10, PD1, and PD3. In order to disable this resistor, strobe the UCPDx_STROBE bit of the SYSCFG_CFGR1 register during start-up sequence.

Expected:

3. Upon reset, a pull-down resistor might be present on PA8, PB15, PD0, or PD2, depending on the voltage level on PA9/PC6, PA10/PB0, PD1, and PD3, respectively. In order to disable this resistor, strobe the UCPDx_STROBE bit of the SYSCFG_CFGR1 register during start-up sequence. (please do it also for G070 and G081)

Nov 2024

I/O port characteristics

STM32H523xx

(Nov 2024)

Figure 20. VIL/VIH for all I/Os except BOOT0

Current:

Expected:

Jun 2024

Electrical

characteristics

STM32G491xC STM32G491xE

DS13122 Rev4

(Apr 2024)

5.2 Absolute maximum rating

Current:

The phrase "Exposure to maximum rating conditions for extended periods may affect device reliability" mentioned twice on the first lines of the Paragraph 5.2.

Expected:

Keep only one phrase.

Sep 2024

RTC

STM32H735xG

DS13312 Rev4

(Nov 2023)

Table 31. "Typical and maximum current consumption in Standby mode"

Current:

The max values are present for “RTC and LSE” ON

Expected:

The max values for “RTC and LSE” should be placed for “RTC and LSE” OFF

Aug 2024

USART

/

UART

STM32H533xx

DS14539 Rev2

(Nov 2024)

STM32H523xx

(Nov 2024)

Figure 1. STM32H5XXxx block diagram

Current:

Expected:

For USAR1, USART2, USART3, UART4, UART5, USART6 :

Update RTS by RTS_DE

Jun 2024

TIM

STM32H757xI

DS12931 Rev3

(Mar 2024)

Tables "Port B alternate functions" and "Port H alternate functions”

Current:

TIM12 AFs are missing in the tables "Port B alternate functions" and "Port H alternate functions" and should be mapped in the AF2

Expected:

Add TIM12 AFs in the tables "Port B alternate functions" and "Port H alternate functions" and should be mapped in the AF2.

Aug 2024

STM32H562xx

and

STM32H563xx

(May 2024)

Table xxx. LPTIMx characteristics

Expected:

to replace:

tTIMxCLK by t_{lptim_ker_ck}

fLPTIMxCLK by f_{lptim_ker_ck}

Oct 2024

STM32U545xx DS14216 Rev4

(Dec 2023)

STM32U535xx

DS14217 Rev 4

(Dec 2023)

STM32U5Axxx

DS13543 Rev 2

(Jul 2023)

STM32U59xxx

DS13633 Rev 2

(Jul 2023)

STM32U5Gxxx

DS14102 Rev 1

(Aug 2023)

STM32U5Fxxx DS14395 Rev 1

(Aug 2023)

STM32U585xx

DS13086 Rev 10

(Jul 2024)

STM32U575xx

DS13737 Rev 10

(Jul 2024)

Table xxx. WWDG min/max timeout value at 160 MHz (PCLK)

Expected:

Correct values for WDGTB = 6

Prescaler : replace 46 by 64
Min timeout value: 1.177 by 1.638
Max timeout value: replace 75.366 by 104.858

Nov 2024

TAMPER

STM32H742xI
STM32H742xG STM32H743xI
STM32H743xG

(Mar 2023)

Table 2. STM32H742xI/G and STM32H743xI/G features and peripheral counts

Current:

The wakeup pins and tamp pins of STM32H743AI are inverted.

Tamper pins : 5
Wakeup pins : 2

Expected :

Replace by :

Tamper pins : 2
Wakeup pins : 5

Apr 2024

Operating conditions

STM32H742xI
STM32H742xG STM32H743xI
STM32H743xG

(Mar 2023)

Table "General operating conditions" located in sections:

- Electrical characteristics (rev Y)

- Electrical characteristics (rev V) sections

Expected:

Remove "Ambient temperature for the suffix 3 version" line.

Apr 2024

STM32G031x4

/x6/x8

DS12992 Rev3

(Oct 2021)

Table. Current consumption in Standby mode

Current:

ULPEN = 0

Expected:

Replace the ULPEN = 0 by ENB_ULP=0.

May 2024

STM32G041x6

/x8

DS12993 Rev3

(Oct 2021)

STM32G071x8

/xB

DS12232 Rev4

(Sep 2021)

STM32G051x6

/x8

DS13303 Rev3

(Nov 2021)

STM32G061x6

/x8

DS13513 Rev3

(Nov 2021)

STM32G081xB

DS12231 Rev4

(Sep 2021)

STM32U083xC

DS14463 Rev2

(Mar 2024)

STM32U073xx

DS14548 Rev2

(Mar 2024)

Table 40. Current consumption in Stop 2 mode

Current:

For “LCD disabled” condition:

- EN_ULP = 0

- EN_ULP = 1

Expected:

For “LCD disabled” condition:

- EN_ULP = 1

- EN_ULP = 0

Jun 2024

Table 41. Current consumption in Standby mode

Current:

For “No independent watchdog” condition:

- EN_ULP = 0

- EN_ULP = 1

Expected:

For “No independent watchdog” condition:

- EN_ULP = 1

- EN_ULP = 0

Jun 2024

Table 42. Current consumption in Shutdown mode

Expected:

Remove in Conditions column: EN_ULP = 0

Jun 2024

STM32H562xx

and

STM32H563xx

(May 2024)

Table xx. 12-bit ADC characteristics

Expected:

- Replace all f_ADC occurrences by "fadc_ker_ck"

- Add note (6) for fadc_ker_ck:

6- This clock frequency is only the analog ADC specification; it also needs to respect the Table xx Maximum allowed clock frequencies.

Oct 2024

STM32H562xx

and

STM32H563xx

(May 2024)

Table xx. Maximum allowed clock frequencies

Current :

- fdac_pclk

- fusb_ker_ck

Expected :

To replace by:

- fdac_ker_ck

- fucpd_ker_ck

Add note (3) for fadc_ker_ck⁽³⁾:

3. This maximum kernel clock frequency does not consider the maximum ADC clock frequency (refer to table xx. 12-bit ADC characteristics)

Oct 2024

STM32WBA5xxx

(Sep 2024)

Table 36. RF receiver Bluetooth Low Energy characteristics

Expected:

Update note (3) in the table:

The payload length used in all receiver tests is 37 bytes which means that the limit for each parameter is reached for a BER of 0.1% (PER of 30.8%), as defined in the Bluetooth core specification v5.4

Nov 2024

STM32WBA5xxx

(Sep 2024)

Table 37. RF Bluetooth Low Energy power consumption for VDD = 3.3 V

Expected:

Nov 2024

STM32H573xx

(May 2024)

STM32H562xx

and

STM32H563xx

(May 2024)

Table xx. Typical and maximum current consumption in VBAT mode

Current :

Expected:

Nov 2024

STM32H562xx and STM32H563xx DS14258 Rev 3

(May 2024)

Table 20. General operating conditions

Current :

Parameter: Power dissipation at T_A = 85 °C for suffix 6 version

Expected:

Update the parameter by:

Power dissipation at T_A = 85 °C or 105°C for suffix 6 or 7 version

Nov 2024

STM32H573xx DS14121 Rev 3

STM32H562xx and STM32H563xx

DS14258 Rev 3

(May 2024)

Table xx. Typical and maximum current consumption in Standby mode

Expected:

Nov 2024

STM32WBA5xxx

(Sep 2024)

Table 56. Low-power mode wake-up timings - LDO

Expected:

Nov 2024

STM32WBA5xxx

(Sep 2024)

Table 57. Low-power mode wake-up timings - SMPS

Expected:

Nov 2024

FMC

STM32H523xx

(Apr 2024)

FMC characteristics section

Current:

Missing Figure “Asynchronous multiplexed PSRAM/NOR write waveforms”

Expected:

Add this figure.

Jun
2024

STM32H7S3x8 STM32H7S7x8

DS14359 Rev4

(Nov 2024)

SDRAM waveforms and timings

Expected:

In all timing tables, Tfmc_ker_ck is the fmc_ker_ck clock period, with the following FMC_SDCLK maximum values:

For 2.7 V<VDD<3.6 V: maximum FMC_CLK = 125 MHz at 20 pF
For 1.71 V<VDD<1.9 V: maximum FMC_CLK = 95 MHz at 20 pF
For 1.71 V<DD<1.9 V: maximum FMC_CLK = 100 MHz at 15 pF

Aug 2024

STM32H7R3x8 STM32H7R7x8

DS14360 Rev3

(Mar 2024)

Aug 2024

ADC

STM32H503xx

DS14053 Rev4

(Oct 2024)

"12-bit ADC characteristics" section

Current:

"Unless otherwise specified, the parameters given in Table xx are derived from tests performed under the ambient temperature, fPCLK2 frequency and VDDA supply voltage conditions summarized in Table yy"

Expected:

Replace "fPCLK2 frequency" by "fHCLK frequency" from the first paragraph in the "12-bit ADC characteristics" section.

Mar 2024

STM32H742xI
STM32H742xG STM32H743xI
STM32H743xG

(Mar 2023)

"16-bit ADC characteristics" sub sections located in sections:

- Electrical characteristics (rev Y)

- Electrical characteristics (rev V) sections

Current:

"Unless otherwise specified, the parameters given in Table xx are derived from tests performed under the ambient temperature, fPCLK2 frequency and VDDA supply voltage conditions summarized in Table yy: General operating conditions".

Expected:

Replace "fPCLK2 frequency" by "fHCLK frequency"from the first paragraph.

Mar 2024

STM32H753xI

DS12117 Rev9

(Mar 2023)

Mar 2024

STM32H750VB STM32H750ZB STM32H750IB STM32H750XB

DS12556 Rev7

(Mar 2023)

Mar 2024

STM32H735xG

DS13312 Rev4

(Nov 2023)

Mar 2024

STM32H735xG

DS13312 Rev4

(Nov 2023)

Table 89. 12-bit ADC accuracy

Current:

Expected:

EG Typical = +/-2 LSBs

EG Max = +/-5 LSBs

May 2024

STM32H742xI
STM32H742xG STM32H743xI
STM32H743xG

(Mar 2023)

Figure 1. STM32H742xI/G block diagram

Figure 2. STM32H743xI/G block diagram

Current:

In Figure 1. STM32H742xI/G block diagram:

1- Up to 20 analog inputs common to ADC1 & 2.

2- Up to 17 analog inputs common to ADC1 and 2

Expected:

To replace by:

1- Up to 20 analog inputs

Most are common to ADC1 & 2

2- Up to 17 analog inputs

Some common to ADC1 and 2

Apr
2024

STM32H747xI
STM32H747xG

DS12930 Rev2

(Mar 2023)

Figure 1. STM32H747xI/G block diagram

Apr
2024

Memory

STM32H573xx

(May 2024)

Table 52. "Flash memory programming"

Current:

Expected:

Mar 2024

STM32H523xx

(Nov 2024)

STM32H533xx

DS14539 Rev2

(Nov 2024)

Table . Dynamic characteristics: eMMC characteristics, VDD = 1.71 to 1.9 V

Current:

- The max value for Output valid time HS: 7/5

- Footnote (3). When using PB13 and PB14

Expected:

- For Output valid time HS, replace the max value '7/5' by 7/75'

- Replace the footnote (3): " When using PB13 & PB14" by "When using PB13"

Jun
2024

DCMI

STM32U5Axxx

DS13543 Rev2

(Jul 2023)

STM32H562xx and STM32H563xx

(May 2024)

STM32H573xx

(May 2024)

Digital camera interface (DCMI)

Current:

The DCMI is a synchronous parallel interface able to receive a high-speed data flow from an external 8-, 10-, 12- or 14-bit CMOS camera module. It supports different data formats: YCbCr4:2:2/RGB565 progressive video and compressed data (JPEG).

Expected:

The digital camera is a synchronous parallel interface able to receive a high-speed data flow from an external 8-, 10-, 12- or 14-bit CMOS camera module. It supports different data formats: YCbCr4:2:2/RGB565 progressive video and compressed data (JPEG).

Oct 2024

SPI

STM32H573xx

(May 2024)

STM32H562xx

and

STM32H563xx