on
2024-06-10
07:00 AM
- edited on
2024-08-05
06:13 AM
by
Laurids_PETERSE
This article includes preliminary updates of STM32 MCU datasheets reported since 1st January 2024. It highlights the current description requiring update and the expected one if available.
The purpose of this article is to deliver any expected updates to our MCU datasheets prior to actual documentation releases. We wish to be transparent with our updates and provide them as fast as possible, to assist you in your design process.
This article is updated on a monthly basis. Once these preliminary updates are manifested in the datasheets, this article is refreshed with new information.
Moving forward, we are also working on providing datasheet releases on a more frequent basis.
IMPORTANT NOTICE - READ CAREFULLY :
Function |
Series (Lines) / |
Update Location |
Current Description / |
Date of added update |
Pinouts, pin description and alternate functions |
STM32H503xx (Sep 2023) |
“Table 10. STM32H503xx pin/ball definition” and in all alternate function tables |
Current: In Alternate functions columns: - USARTx_RTS - LPUART1_RTS Expected: Replace by: - USARTx_RTS/USARTx_DE - LPUART1_RTS/LPUART1_DE |
Mar 2024 |
STM32G0B0KE/ CE/RE/VE (Feb 2021) |
Table 10. Terms and symbols used in Table 11 |
Expected: - Add _c, _d and _u symbols for I/O structure |
Jun 2024 |
|
STM32G0B0KE/ CE/RE/VE (Feb 2021) |
Table 11. Pin assignment and description |
Current: The footnote (1): 1. PC13, PC14 and PC15 are supplied through the power switch. Since the switch only sinks a limited amount of current (3 mA), the use of GPIOs PC13 to PC15 in output mode is limited: - The speed should not exceed 2 MHz with a maximum load of 30 pF - These GPIOs must not be used as current sources (for example to drive a LED). Expected: Update the footnote (1): 1. PC13, PC14 and PC15 are supplied through the power switch. Since the switch only provides a limited amount of current (3 mA), the use of GPIOs PC13 to PC15 in output mode is limited: - The speed should not exceed 2 MHz with a maximum load of 30 pF - These GPIOs can be used as current sinks but not as current sources. |
Jun 2024 |
|
Expected: Add this note and mark the pins mentioned here with a note marker stating this: - Upon reset, a pull-down resistor might be present on PA8, PB15, PD0, or PD2 depending on voltage level on PA9, PA10, PD1, and PD3, respectively. In order to disable this resistor, strobe the UCPDx_STROBE bits in SYSCFG_CFGR1 register during start-up sequence. |
Jun 2024 |
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Current: The footnote (4) in Table 11. Pin assignment and description: 4. USB-related alternate or additional functions do not apply to 32-pin package. Expected: Remove this note. |
Jun 2024
|
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STM32WL5MOC (Feb 2024)
|
Table 4. STM32WL5MOC pin definition |
Current: Pin name for pin 42 is PE12 Expected: Pin 42 must be PA12 (not PE12) |
Jun 2024 |
|
STM32WL5MOC (Feb 2024)
|
Current: The footnote (2) for pin 40 must be used only as I2C2_SCL: 2. It must be used only as I2C2_SCL on STM32WL5MOCH6S Expected: The footnote (2) must be used as I2C2_SDA (not I2C2_SCL): 2. It must be used only as I2C2_SDA on STM32WL5MOCH6S |
Jun 2024 |
||
STM32H533xx (April 2024)
STM32H523xx (April 2024) |
Table xx. STM32H5XXxx pin/ball definition
Table xx. Alternate function AF0 to AF7
Table xx. Alternate function AF8 to AF15 |
Current: The following name to update: - LPUART1_RTS - USART1_RTS - USART2_RTS - USART3_RTS - UART4_RTS - UART5_RTS - USART6_RTS Expected: The correct name should be: - LPUART1_RTS/LPUART1_DE - USART1_RTS/USART1_DE - USART2_RTS/USART2_DE - USART3_RTS/USART3_DE - UART4_RTS/UART4_DE - UART5_RTS/UART5_DE - USART6_RTS/USART6_DE |
Jun 2024 |
|
STM32H523xx (April 2024) |
Figure 11. UFBGA144 ballout |
Expected: Replace M12 by VSS in figure 11 |
Jun 2024 |
|
I/O port characteristics
|
STM32H533xx (April 2024)
STM32H523xx (April 2024) |
Figure 20. VIL/VIH for all I/Os except BOOT0 |
Current:
Expected: |
Jun 2024 |
GPIO |
STM32H503xx (Sep 2023) |
Table 2. STM32H503xx features and peripheral counts |
Current: Number of GPIOs on UFQFPN32 package: 24 Expected: Number of GPIOs on UFQFPN32 should be 26. |
Mar 2024 |
RTC |
STM32F405xx STM32F407xx (Aug 2020) |
2.2.18 Real-time clock (RTC), backup SRAM and backup registers |
Current: RTC can be clocked by HSE/128: “It is clocked by a 32.768 kHz external crystal, resonator or oscillator, the internal low-power RC oscillator or the high-speed external clock divided by 128.” Expected: It is clocked by a 32.768 kHz external crystal, resonator or oscillator, the internal low-power RC oscillator or the high-speed external clock divided by 2 to 31. |
Apr 2024 |
STM32F405xx STM32F407xx (Aug 2020) |
Table 33. LSE oscillator characteristics (fLSE = 32.768 kHz) |
Current: The unit of fosc_IN is Mhz. Expected: The unit of fosc_IN should be Khz. |
Apr 2024 |
|
RCC |
STM32WBA5xxx (Feb 2024) |
Figure 6. Clock tree |
Current: Figure 6. Clock tree Expected: |
Jul 2024 |
USART / UART
|
STM32H503xx (Sept 2023) |
Figure 1. STM32H503xx block diagram |
Current: USART1, USART2, USART3: RX, TX, CK, CTS, RTS as AF Expected: USART1, USART2, USART3 : RX, TX, CK, CTS, RTS_DE as AF. |
Apr 2024 |
STM32H533xx (April 2024)
STM32H523xx (April 2024) |
Figure 1. STM32H5XXxx block diagram |
Current:
Expected: For USAR1, USART2, USART3, UART4, UART5, USART6 : Update RTS by RTS_DE |
Jun 2024 |
|
SPI |
STM32G0B0KE/ CE/RE/VE (Feb 2021) |
Table 1. Features and peripheral counts |
Current: Peripheral counts for SPI [I2S]: 3 Expected: Peripheral counts for SPI [I2S]: 3 + 6 extra through USARTs |
Jun 2024
|
Power Control (PWR) |
STM32G0B0KE/ CE/RE/VE (Feb 2021) |
Figure 2. Power supply overview |
Current: Expected: |
Jun 2024
|
STM32G0B0KE/ CE/RE/VE (Feb 2021) |
Figure 1. Block diagram |
Current: - With PVD Expected: - Remove PVD |
Jun 2024 |
|
STM32G0B0KE/ CE/RE/VE (Feb 2021) |
Figure 9. Power supply scheme |
Current: Expected: Add VDD and VSS pins, rework decoupling on external VDD net and add a note for VREF+. |
Jun 2024
|
|
STM32G0B0KE/ CE/RE/VE (Feb 2021) |
|
Current: Expected: |
Jun 2024
|
|
STM32G0B0KE/ CE/RE/VE (Feb 2021) |
Table 21. Current characteristics |
Current: - The rating: “Current into VDD/VDDA power pin (source)” Expected: - Update the rating in the Table 21. Current characteristics to: “Current into VDD/VDDA and VDD power pins (source)” |
Jun 2024
|
|
TAMPER |
STM32H742xI (Mar 2023) |
Table 2. STM32H742xI/G and STM32H743xI/G features and peripheral counts |
Current: The wakeup pins and tamp pins of STM32H743AI are inverted.
Expected : Replace by :
|
Apr 2024 |
Operating conditions
|
STM32H742xI (Mar 2023) |
Table "General operating conditions" located in sections: - Electrical characteristics (rev Y) - Electrical characteristics (rev V) sections |
Current: Expected: Remove "Ambient temperature for the suffix 3 version" line. |
Apr 2024 |
STM32G031x4 /x6/x8 (Oct 2021) |
Table. Current consumption in Standby mode |
Current: ULPEN = 0
Expected: Replace the ULPEN = 0 by ENB_ULP=0. |
May 2024 |
|
STM32G0C1xC /xE (Dec 2022) |
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STM32G041x6 /x8 (Oct 2021) |
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STM32G071x8 /xB (Sep 2021) |
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STM32G051x6 /x8 (Nov 2021) |
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STM32G061x6 /x8 (Nov 2021) |
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STM32G081xB (Sep 2021) |
||||
STM32G0B0KE/ CE/RE/VE (Feb 2021) |
Table 30. Current consumption in Stop 1 mode |
Current:
Expected: |
Jun 2024
|
|
STM32U083xC (Mar 2024)
(Applicable for STM32U073xx (Mar 2024) |
Table 40. Current consumption in Stop 2 mode |
Current: For “LCD disabled” condition: - EN_ULP = 0 - EN_ULP = 1 Expected: For “LCD disabled” condition: - EN_ULP = 1 - EN_ULP = 0 |
Jun 2024 |
|
Table 41. Current consumption in Standby mode |
Current: For “No independent watchdog” condition: - EN_ULP = 0 - EN_ULP = 1 Expected: For “No independent watchdog” condition: - EN_ULP = 1 - EN_ULP = 0 |
Jun 2024 |
||
Table 42. Current consumption in Shutdown mode |
Expected: Remove in Conditions column: EN_ULP = 0 |
Jun 2024 |
||
STM32H533xx (April 2024)
STM32H523xx (April 2024) |
Table 21. Maximum allowed clock frequencies |
Current: Symbol: "fadc_ker_ck " Replace by "fadc_ker_ck_input" |
Jun 2024 |
|
STM32H533xx (April 2024) |
Table 20. General operating conditions |
Current: See Table 137 for appropriate thermal resistance and package. Expected: See Table 130 for appropriate thermal resistance and package. |
Jun 2024 |
|
STM32H523xx (April 2024) |
Table 19. General operating conditions |
Current: See Table 137 for appropriate thermal resistance and package. Expected: See Table 129 for appropriate thermal resistance and package. |
Jun 2024 |
|
STM32WBA5xxx (Feb 2024) |
Table 32. Generic RF transmitter characteristics |
Current: Expected: Update "TBD":
|
Jul 2024 |
|
STM32WBA5xxx (Feb 2024) |
Table 35. RF transmitter Bluetooth Low Energy characteristics |
Current: Expected: Update "TBD":
|
Jul 2024 |
|
STM32WBA5xxx (Feb 2024) |
Table 41. RF IEEE802.15.4 power consumption for VDD = 3.3 V |
Current: Expected: Update "TBD" for:
|
Jul 2024 |
|
STM32WBA5xxx (Feb 2024) |
Table 63. LSE clock source requirements |
Current: Footnote 3: AC coupled is supported (capacitor TBD). Expected: AC coupled is supported (capacitor 10pF). |
Jul 2024 |
|
STM32WBA5xxx (Feb 2024) |
Table 93. USART characteristics |
Current: Expected: |
Jul 2024 |
|
FMC |
STM32H533xx (Apr 2024)
STM32H523xx (April 2024) |
FMC characteristics section |
Current: Missing Figure “Asynchronous multiplexed PSRAM/NOR write waveforms” Expected: Add this figure. |
Jun 2024 |
ADC
|
STM32H503xx (Sep 2023) |
"12-bit ADC characteristics" section |
Current: "Unless otherwise specified, the parameters given in Table xx are derived from tests performed under the ambient temperature, fPCLK2 frequency and VDDA supply voltage conditions summarized in Table yy" Expected: Replace "fPCLK2 frequency" by "fHCLK frequency" from the first paragraph in the "12-bit ADC characteristics" section. |
Mar 2024 |
STM32H742xI (Mar 2023) |
"16-bit ADC characteristics" sub sections located in sections: - Electrical characteristics (rev Y) - Electrical characteristics (rev V) sections |
Current: "Unless otherwise specified, the parameters given in Table xx are derived from tests performed under the ambient temperature, fPCLK2 frequency and VDDA supply voltage conditions summarized in Table yy: General operating conditions". Expected: Replace "fPCLK2 frequency" by "fHCLK frequency"from the first paragraph. |
Mar 2024 |
|
STM32H753xI (Mar 2023) |
Mar 2024 |
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STM32H750VB STM32H750ZB STM32H750IB STM32H750XB (Mar 2023) |
Mar 2024 |
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STM32H735xG (Nov 2023) |
Mar 2024 |
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STM32H735xG (Nov 2023) |
Table 89. 12-bit ADC accuracy |
Current:
Expected: EG Typical = +/-2 LSBs EG Max = +/-5 LSBs |
May 2024 |
|
STM32H742xI (Mar 2023) |
Figure 1. STM32H742xI/G block diagram
Figure 2. STM32H743xI/G block diagram |
Current: In Figure 1. STM32H742xI/G block diagram: 1- Up to 20 analog inputs common to ADC1 & 2. 2- Up to 17 analog inputs common to ADC1 and 2 Expected: To replace by: 1- Up to 20 analog inputs Most are common to ADC1 & 2 2- Up to 17 analog inputs Some common to ADC1 and 2 |
Apr 2024 |
|
STM32H747xI (Mar 2023) |
Figure 1. STM32H747xI/G block diagram |
Apr 2024 |
||
Memory |
STM32H573xx (May 2024) |
Table 52 "Flash memory programming" |
Current: Expected: |
Mar 2024 |
STM32H562xx and STM32H563xx (May 2024) |
Table 51 "Flash memory programming" |
Current: Expected: |
Mar 2024 |
|
STM32H523xx (April 2024)
STM32H533xx (April 2024) |
Table 49. Flash memory programming |
Current: Expected: |
Jun 2024 |
|
STM32H523xx (April 2024)
STM32H533xx (Apr 2024) |
Table . Dynamic characteristics: eMMC characteristics, VDD = 1.71 to 1.9 V |
Current: - The max value for Output valid time HS: 7/5 - Footnote (3). When using PB13 and PB14 Expected: - For Output valid time HS, replace the max value '7/5' by 7/75' - Replace the footnote (3): " When using PB13 & PB14" by "When using PB13" |
Jun 2024 |
|
SDMMC |
STM32H523xx (April 2024)
STM32H533xx (April 2024) |
Table . SDMMC features |
Current: Expected: Remove the SDMMC2 column, since the SDMMC2 is not available on STM32H523/533 devices |
Jun 2024 |
STM32H523xx (April 2024)
STM32H533xx (April 2024) |
Table . Dynamic characteristics: SD/MMC characteristics, VDD = 2.7 to 3.6 V |
Current: Footnote: 3. When using PB13 & PB14 Expected: Replace the footnote 3 " When using PB13 & PB14" by "When using PB13" |
Jun 2024 |
|
USB |
STM32F373xx (Jun 2016) |
Table 12 Alternate functions for port PA. |
Current: Missing USB mapped on PA11-PA12 as AF14 Expected: Add USB mapped on PA11-PA12 as AF14. |
Apr 2024 |
STM32G0B0KE/ CE/RE/VE (Feb 2021) |
Table 1. Features and peripheral counts |
Current:
Expected: Remove “None” for USB from Table 1. Features and peripheral counts. |
Jun 2024
|
|
STM32G0B0KE/ CE/RE/VE (Feb 2021) |
3.20 Universal serial bus full-speed host/device interface (USB) |
Current: Note: The embedded USB controller cannot be used on STM32G0B0KE as this device does not provide an HSE oscillator input Expected: Note: On STM32G0B0KE device, only HSE external source clock is available. |
Jun 2024
|
|
Package information
|
STM32F405xx STM32F407xx (Aug 2020) |
Table 96. UFBGA176+2 recommended PCB design rules (0.65 mm pitch BGA) |
Current: Table name: UFBGA176+2 recommended PCB design rules (0.65 mm pitch BGA) Expected: Table name: UFBGA176+25 recommended PCB design rules (0.65 mm pitch BGA) |
Mar 2024 |
STM32WBA5xxx (Feb 2024) |
Table 102. Package thermal characteristics |
Current: Expected: Replace "TBD" value for:
|
Jul 2024 |