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How to Interpret HCI/LMP Subversion for STM32WB55xx

dagraves1
Associate

I am working with the STM32WB55VGQ6 and using the V1.23.0 / 02-June-2025 STM32WB Copro Wireless Binaries. Specifically,  stm32wb5x_FUS_fw.bin @ 0x080EE000 and stm32wb5x_BLE_Stack_full_fw.bin @ 0x080D0000.

The STM32WB BLE API (hci_le) provides the function to read the values for the version information for the local Controller (`hci_read_local_version_information`).

Per the BLE Core 5.4 spec:

The HCI_Version information defines the version information of the HCI layer. The LMP_Version information defines the version of the LMP. The Company_Identifier information indicates the manufacturer of the local device.

The HCI_Subversion and LMP_Subversion are vendor-specific.

Since the Bluetooth Core Specification defines these as vendor-specific, could you please provide documentation on how to interpret them for your devices?

Specifically, I'd like to know:

  1. Where are these values documented?
  2. How can we decipher them to understand details like the silicon revision or firmware patch level?

Thank you for your assistance.

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