Hi, could you confirm that the EMIF06-HSD03F3 footprint has bga pads that are all 0.4mm from each other? The datasheet drawing of the footprint is a bit misleading and has the pads asymmetrical, but it looks like from the dimensions that it is symetrical.

[Dave Kearney]

https://www.st.com/resource/en/datasheet/emif06-hsd03f3.pdf

[Mohamed S.]

Hello Dave,

I confirm that EMIF06-HSD03F3 has bump pads that are all 0.4mm from each other as shown in figure 12 of its datasheet and reproduced below.

I hope this answers your question.

Do not hesitate to look at our resources like ESD FAQ or ESD protections for MCUs peripherals to make sure your design is robust against any ESD surge that can enter from any connector exposed to ESD discharge.

[Dave Kearney]

Thanks, do you think it would make sense to redraw the above figure then? The pads are clearly not all the same distance apart on the drawing - the middle column of pads is noticeably closer to the right than the left on both drawings in the datasheet - so it is a bit confusing.

Cheers,

Dave

[DSass.1]

Just to make sure : Bump side = bottom side?

Thanks

Dori

[Mohamed S.]

Yes, bump side is bottom side.